Structure and electric resistance of Sn–Cu(Ag) solders within pre-crystallization temperature region

за авторством S. I. Mudryi, I. I. Shtablavyi, V. M. Skliarchuk, Yu. O. Plevachuk, A. V. Korolyshyn, A. S. Yakymovych, I. M. Shevernoha, Ye. Sidorov
Опубліковано 2010