Features of electrochemical processes at the boundary p-GaAs-HF water solution von G. A. Pashchenko, Yu. Kravetskyi, L. I. Trishchuk

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Modeling the process of removal aimed at cut traces on semiconductor wafers by using the method of contactless chemical-and-dynamical polishing von G. A. Pashchenko, Yu. Kravetskyi, A. V. Fomin

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Model of smoothing roughness on GaAs wafer surface by using nonabrasive chemical-and-mechanical polishing von A. V. Fomin, G. A. Pashchenko, Yu. Kravetskyi, I. G. Lutsyshyn

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