Electron Backscatter Diffraction Analysis of the Microstructure Fineness in Pure Copper under Torsional Deformation von Wang, C.P., Fan, J.K., Li, F.G., Liu, J.C.

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Modified Norris–Landzberg Model and Optimum Design of Temperature Cycling ALT von Sun, F.Q., Liu, J.C., Cao, Z.Q., Li, X.Y., Jiang, T.M.

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