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Modern technologies of soldering, providing increased strength and ductility of metal joints
Sometimes, the operations of electronic devices have failures due to lack of strength and ductility of the metal solder joints. As known, a main condition for ensuring of the required strength and ductility of the metal compounds is the choice of optimal brazing temperature. As the result of theo...
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| Main Authors: | , |
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| Format: | Article |
| Language: | English |
| Published: |
Інститут металофізики ім. Г.В. Курдюмова НАН України
2013
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| Series: | Металлофизика и новейшие технологии |
| Subjects: | |
| Online Access: | http://dspace.nbuv.gov.ua/handle/123456789/104271 |
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| Summary: | Sometimes, the operations of electronic devices have failures due to lack of
strength and ductility of the metal solder joints. As known, a main condition
for ensuring of the required strength and ductility of the metal compounds is
the choice of optimal brazing temperature. As the result of theoretical and
experimental studies, the dependences connecting the surface temperature of
joint metals and alloys with the parameters of the wave, laser, convection
soldering are obtained. The use of the mentioned relationships increases the
efficiency of fabrication of strength and ductile solder joints. |
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