Defects and supersolidity: effects of annealing and stress on elastic behavior of solid ⁴He
Recent measurements showed that solid ⁴He can decouple from a torsional oscillator below 200 mK and defects appear to be crucial to this behavior. Helium’s shear modulus increases in the same range, which can be understood in terms of dislocations pinned by ³He impurities at the lowest temperature...
Збережено в:
Видавець: | Фізико-технічний інститут низьких температур ім. Б.І. Вєркіна НАН України |
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Дата: | 2008 |
Автори: | , , |
Формат: | Стаття |
Мова: | English |
Опубліковано: |
Фізико-технічний інститут низьких температур ім. Б.І. Вєркіна НАН України
2008
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Назва видання: | Физика низких температур |
Теми: | |
Онлайн доступ: | http://dspace.nbuv.gov.ua/handle/123456789/116908 |
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Цитувати: | Defects and supersolidity: effects of annealing and stress on elastic behavior of solid ⁴He / A. Syshchenko, J. Day, J. Beamish // Физика низких температур. — 2008. — Т. 34, № 4-5. — С. 427–430. — Бібліогр.: 31 назв. — англ. |
Репозиторії
Digital Library of Periodicals of National Academy of Sciences of UkraineРезюме: | Recent measurements showed that solid ⁴He can decouple from a torsional oscillator below 200 mK and
defects appear to be crucial to this behavior. Helium’s shear modulus increases in the same range, which can
be understood in terms of dislocations pinned by ³He impurities at the lowest temperatures, but mobile
above 100 mK. We have measured helium’s pressure and shear modulus to study the effects of annealing and
stresses applied at low temperatures. Pressure gradients produced during crystal growth or plastic deformation
are greatly reduced by annealing, but only at temperatures close to melting. Annealing does not change
the low-temperature modulus but usually raises it at high temperature, as expected if annealing eliminates
some dislocations. Large stresses also affect the modulus, but these changes are reversed by heating above
0.5 K, suggesting that defects introduced by stress are easier to anneal than those produced during growth. |
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