Low-temperature deposition of silicon dioxide films in high-density plasma

One of the basic operations in the LED (light-emitting diode) chip fabrication technique is formation of dielectric coatings for the purpose of insulation and surface passivation of the LED structure. Oxides and nitrides of silicon obtained by physical or chemical vapor deposition techniques can...

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Видавець:Інститут фізики напівпровідників імені В.Є. Лашкарьова НАН України
Дата:2013
Автори: Yasunas, A., Kotov, D., Shiripov, V., Radzionay, U.
Формат: Стаття
Мова:English
Опубліковано: Інститут фізики напівпровідників імені В.Є. Лашкарьова НАН України 2013
Назва видання:Semiconductor Physics Quantum Electronics & Optoelectronics
Онлайн доступ:http://dspace.nbuv.gov.ua/handle/123456789/117696
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Цитувати:Low-temperature deposition of silicon dioxide films in high-density plasma / A. Yasunas, D. Kotov, V. Shiripov, U. Radzionay // Semiconductor Physics Quantum Electronics & Optoelectronics. — 2013. — Т. 16, № 2. — С. 216-219. — Бібліогр.: 2 назв. — англ.

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Digital Library of Periodicals of National Academy of Sciences of Ukraine
id irk-123456789-117696
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spelling irk-123456789-1176962017-05-27T03:03:07Z Low-temperature deposition of silicon dioxide films in high-density plasma Yasunas, A. Kotov, D. Shiripov, V. Radzionay, U. One of the basic operations in the LED (light-emitting diode) chip fabrication technique is formation of dielectric coatings for the purpose of insulation and surface passivation of the LED structure. Oxides and nitrides of silicon obtained by physical or chemical vapor deposition techniques can act as such a coating. Low conformity of physical vapor deposition techniques limits the possibility of their application in a number of cases at LED mesostructures passivation. This work represents the results of experiments on silicon dioxide dielectric films deposition in the inductive coupled plasma under different operation conditions. The findings prove the possibility of lowtemperature deposition of thick silicon dioxide films with high conformality by the HDPCVD (high-density plasma chemical vapor deposition) technique. 2013 Article Low-temperature deposition of silicon dioxide films in high-density plasma / A. Yasunas, D. Kotov, V. Shiripov, U. Radzionay // Semiconductor Physics Quantum Electronics & Optoelectronics. — 2013. — Т. 16, № 2. — С. 216-219. — Бібліогр.: 2 назв. — англ. 1560-8034 PACS 78.20.-e, 82.33.Xj http://dspace.nbuv.gov.ua/handle/123456789/117696 en Semiconductor Physics Quantum Electronics & Optoelectronics Інститут фізики напівпровідників імені В.Є. Лашкарьова НАН України
institution Digital Library of Periodicals of National Academy of Sciences of Ukraine
collection DSpace DC
language English
description One of the basic operations in the LED (light-emitting diode) chip fabrication technique is formation of dielectric coatings for the purpose of insulation and surface passivation of the LED structure. Oxides and nitrides of silicon obtained by physical or chemical vapor deposition techniques can act as such a coating. Low conformity of physical vapor deposition techniques limits the possibility of their application in a number of cases at LED mesostructures passivation. This work represents the results of experiments on silicon dioxide dielectric films deposition in the inductive coupled plasma under different operation conditions. The findings prove the possibility of lowtemperature deposition of thick silicon dioxide films with high conformality by the HDPCVD (high-density plasma chemical vapor deposition) technique.
format Article
author Yasunas, A.
Kotov, D.
Shiripov, V.
Radzionay, U.
spellingShingle Yasunas, A.
Kotov, D.
Shiripov, V.
Radzionay, U.
Low-temperature deposition of silicon dioxide films in high-density plasma
Semiconductor Physics Quantum Electronics & Optoelectronics
author_facet Yasunas, A.
Kotov, D.
Shiripov, V.
Radzionay, U.
author_sort Yasunas, A.
title Low-temperature deposition of silicon dioxide films in high-density plasma
title_short Low-temperature deposition of silicon dioxide films in high-density plasma
title_full Low-temperature deposition of silicon dioxide films in high-density plasma
title_fullStr Low-temperature deposition of silicon dioxide films in high-density plasma
title_full_unstemmed Low-temperature deposition of silicon dioxide films in high-density plasma
title_sort low-temperature deposition of silicon dioxide films in high-density plasma
publisher Інститут фізики напівпровідників імені В.Є. Лашкарьова НАН України
publishDate 2013
url http://dspace.nbuv.gov.ua/handle/123456789/117696
citation_txt Low-temperature deposition of silicon dioxide films in high-density plasma / A. Yasunas, D. Kotov, V. Shiripov, U. Radzionay // Semiconductor Physics Quantum Electronics & Optoelectronics. — 2013. — Т. 16, № 2. — С. 216-219. — Бібліогр.: 2 назв. — англ.
series Semiconductor Physics Quantum Electronics & Optoelectronics
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AT kotovd lowtemperaturedepositionofsilicondioxidefilmsinhighdensityplasma
AT shiripovv lowtemperaturedepositionofsilicondioxidefilmsinhighdensityplasma
AT radzionayu lowtemperaturedepositionofsilicondioxidefilmsinhighdensityplasma
first_indexed 2023-10-18T20:30:24Z
last_indexed 2023-10-18T20:30:24Z
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