Thermal simulation of heterogeneous structural components in microelectronic devices
The steady state nonlinear problem of thermal conduction for isotropic strip with foreign rectangular inclusion that heats as an internal thermal source with heat dissipation has been considered. The methodology to solve this problem and its application for the specific dependence of the thermal-...
Збережено в:
| Дата: | 2010 |
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| Автори: | , |
| Формат: | Стаття |
| Мова: | English |
| Опубліковано: |
Інститут фізики напівпровідників імені В.Є. Лашкарьова НАН України
2010
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| Назва видання: | Semiconductor Physics Quantum Electronics & Optoelectronics |
| Онлайн доступ: | http://dspace.nbuv.gov.ua/handle/123456789/118738 |
| Теги: |
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| Назва журналу: | Digital Library of Periodicals of National Academy of Sciences of Ukraine |
| Цитувати: | Thermal simulation of heterogeneous structural components in microelectronic devices / V.I. Gavrysh, D.V. Fedasyuk // Semiconductor Physics Quantum Electronics & Optoelectronics. — 2010. — Т. 13, № 4. — С. 439-443. — Бібліогр.: 7 назв. — англ. |
Репозиторії
Digital Library of Periodicals of National Academy of Sciences of Ukraine| Резюме: | The steady state nonlinear problem of thermal conduction for isotropic strip
with foreign rectangular inclusion that heats as an internal thermal source with heat
dissipation has been considered. The methodology to solve this problem and its
application for the specific dependence of the thermal-conductivity coefficients on
temperature has been offered. |
|---|