Thermal simulation of heterogeneous structural components in microelectronic devices
The steady state nonlinear problem of thermal conduction for isotropic strip with foreign rectangular inclusion that heats as an internal thermal source with heat dissipation has been considered. The methodology to solve this problem and its application for the specific dependence of the thermal-...
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Дата: | 2010 |
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Автори: | , |
Формат: | Стаття |
Мова: | English |
Опубліковано: |
Інститут фізики напівпровідників імені В.Є. Лашкарьова НАН України
2010
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Назва видання: | Semiconductor Physics Quantum Electronics & Optoelectronics |
Онлайн доступ: | http://dspace.nbuv.gov.ua/handle/123456789/118738 |
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Назва журналу: | Digital Library of Periodicals of National Academy of Sciences of Ukraine |
Цитувати: | Thermal simulation of heterogeneous structural components in microelectronic devices / V.I. Gavrysh, D.V. Fedasyuk // Semiconductor Physics Quantum Electronics & Optoelectronics. — 2010. — Т. 13, № 4. — С. 439-443. — Бібліогр.: 7 назв. — англ. |
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irk-123456789-1187382017-06-01T03:04:45Z Thermal simulation of heterogeneous structural components in microelectronic devices Gavrysh, V.I. Fedasyuk, D.V. The steady state nonlinear problem of thermal conduction for isotropic strip with foreign rectangular inclusion that heats as an internal thermal source with heat dissipation has been considered. The methodology to solve this problem and its application for the specific dependence of the thermal-conductivity coefficients on temperature has been offered. 2010 Article Thermal simulation of heterogeneous structural components in microelectronic devices / V.I. Gavrysh, D.V. Fedasyuk // Semiconductor Physics Quantum Electronics & Optoelectronics. — 2010. — Т. 13, № 4. — С. 439-443. — Бібліогр.: 7 назв. — англ. 1560-8034 PACS 74.25.fc http://dspace.nbuv.gov.ua/handle/123456789/118738 en Semiconductor Physics Quantum Electronics & Optoelectronics Інститут фізики напівпровідників імені В.Є. Лашкарьова НАН України |
institution |
Digital Library of Periodicals of National Academy of Sciences of Ukraine |
collection |
DSpace DC |
language |
English |
description |
The steady state nonlinear problem of thermal conduction for isotropic strip
with foreign rectangular inclusion that heats as an internal thermal source with heat
dissipation has been considered. The methodology to solve this problem and its
application for the specific dependence of the thermal-conductivity coefficients on
temperature has been offered. |
format |
Article |
author |
Gavrysh, V.I. Fedasyuk, D.V. |
spellingShingle |
Gavrysh, V.I. Fedasyuk, D.V. Thermal simulation of heterogeneous structural components in microelectronic devices Semiconductor Physics Quantum Electronics & Optoelectronics |
author_facet |
Gavrysh, V.I. Fedasyuk, D.V. |
author_sort |
Gavrysh, V.I. |
title |
Thermal simulation of heterogeneous structural components in microelectronic devices |
title_short |
Thermal simulation of heterogeneous structural components in microelectronic devices |
title_full |
Thermal simulation of heterogeneous structural components in microelectronic devices |
title_fullStr |
Thermal simulation of heterogeneous structural components in microelectronic devices |
title_full_unstemmed |
Thermal simulation of heterogeneous structural components in microelectronic devices |
title_sort |
thermal simulation of heterogeneous structural components in microelectronic devices |
publisher |
Інститут фізики напівпровідників імені В.Є. Лашкарьова НАН України |
publishDate |
2010 |
url |
http://dspace.nbuv.gov.ua/handle/123456789/118738 |
citation_txt |
Thermal simulation of heterogeneous structural components
in microelectronic devices / V.I. Gavrysh, D.V. Fedasyuk // Semiconductor Physics Quantum Electronics & Optoelectronics. — 2010. — Т. 13, № 4. — С. 439-443. — Бібліогр.: 7 назв. — англ. |
series |
Semiconductor Physics Quantum Electronics & Optoelectronics |
work_keys_str_mv |
AT gavryshvi thermalsimulationofheterogeneousstructuralcomponentsinmicroelectronicdevices AT fedasyukdv thermalsimulationofheterogeneousstructuralcomponentsinmicroelectronicdevices |
first_indexed |
2023-10-18T20:32:47Z |
last_indexed |
2023-10-18T20:32:47Z |
_version_ |
1796150465983938560 |