Thermal simulation of heterogeneous structural components in microelectronic devices

The steady state nonlinear problem of thermal conduction for isotropic strip with foreign rectangular inclusion that heats as an internal thermal source with heat dissipation has been considered. The methodology to solve this problem and its application for the specific dependence of the thermal-...

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Видавець:Інститут фізики напівпровідників імені В.Є. Лашкарьова НАН України
Дата:2010
Автори: Gavrysh, V.I., Fedasyuk, D.V.
Формат: Стаття
Мова:English
Опубліковано: Інститут фізики напівпровідників імені В.Є. Лашкарьова НАН України 2010
Назва видання:Semiconductor Physics Quantum Electronics & Optoelectronics
Онлайн доступ:http://dspace.nbuv.gov.ua/handle/123456789/118738
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Цитувати:Thermal simulation of heterogeneous structural components in microelectronic devices / V.I. Gavrysh, D.V. Fedasyuk // Semiconductor Physics Quantum Electronics & Optoelectronics. — 2010. — Т. 13, № 4. — С. 439-443. — Бібліогр.: 7 назв. — англ.

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Digital Library of Periodicals of National Academy of Sciences of Ukraine
id irk-123456789-118738
record_format dspace
spelling irk-123456789-1187382017-06-01T03:04:45Z Thermal simulation of heterogeneous structural components in microelectronic devices Gavrysh, V.I. Fedasyuk, D.V. The steady state nonlinear problem of thermal conduction for isotropic strip with foreign rectangular inclusion that heats as an internal thermal source with heat dissipation has been considered. The methodology to solve this problem and its application for the specific dependence of the thermal-conductivity coefficients on temperature has been offered. 2010 Article Thermal simulation of heterogeneous structural components in microelectronic devices / V.I. Gavrysh, D.V. Fedasyuk // Semiconductor Physics Quantum Electronics & Optoelectronics. — 2010. — Т. 13, № 4. — С. 439-443. — Бібліогр.: 7 назв. — англ. 1560-8034 PACS 74.25.fc http://dspace.nbuv.gov.ua/handle/123456789/118738 en Semiconductor Physics Quantum Electronics & Optoelectronics Інститут фізики напівпровідників імені В.Є. Лашкарьова НАН України
institution Digital Library of Periodicals of National Academy of Sciences of Ukraine
collection DSpace DC
language English
description The steady state nonlinear problem of thermal conduction for isotropic strip with foreign rectangular inclusion that heats as an internal thermal source with heat dissipation has been considered. The methodology to solve this problem and its application for the specific dependence of the thermal-conductivity coefficients on temperature has been offered.
format Article
author Gavrysh, V.I.
Fedasyuk, D.V.
spellingShingle Gavrysh, V.I.
Fedasyuk, D.V.
Thermal simulation of heterogeneous structural components in microelectronic devices
Semiconductor Physics Quantum Electronics & Optoelectronics
author_facet Gavrysh, V.I.
Fedasyuk, D.V.
author_sort Gavrysh, V.I.
title Thermal simulation of heterogeneous structural components in microelectronic devices
title_short Thermal simulation of heterogeneous structural components in microelectronic devices
title_full Thermal simulation of heterogeneous structural components in microelectronic devices
title_fullStr Thermal simulation of heterogeneous structural components in microelectronic devices
title_full_unstemmed Thermal simulation of heterogeneous structural components in microelectronic devices
title_sort thermal simulation of heterogeneous structural components in microelectronic devices
publisher Інститут фізики напівпровідників імені В.Є. Лашкарьова НАН України
publishDate 2010
url http://dspace.nbuv.gov.ua/handle/123456789/118738
citation_txt Thermal simulation of heterogeneous structural components in microelectronic devices / V.I. Gavrysh, D.V. Fedasyuk // Semiconductor Physics Quantum Electronics & Optoelectronics. — 2010. — Т. 13, № 4. — С. 439-443. — Бібліогр.: 7 назв. — англ.
series Semiconductor Physics Quantum Electronics & Optoelectronics
work_keys_str_mv AT gavryshvi thermalsimulationofheterogeneousstructuralcomponentsinmicroelectronicdevices
AT fedasyukdv thermalsimulationofheterogeneousstructuralcomponentsinmicroelectronicdevices
first_indexed 2023-10-18T20:32:47Z
last_indexed 2023-10-18T20:32:47Z
_version_ 1796150465983938560