Investigation of residual stresses in sapphire plates after grinding and polishing

The method of flexure determination was used to investigate the dependence of residual stresses on the depth of damaged layer in sapphire plates with a diameter of 100 mm after grinding and polishing. The flexure was determined from nonflatness of the control side of the plate using an interferomete...

Повний опис

Збережено в:
Бібліографічні деталі
Дата:2012
Автори: Budnikov, A.T., Vovk, E.A., Kanishchev, V.N., Krivonogov, S.I.
Формат: Стаття
Мова:English
Опубліковано: НТК «Інститут монокристалів» НАН України 2012
Назва видання:Functional Materials
Теми:
Онлайн доступ:http://dspace.nbuv.gov.ua/handle/123456789/135375
Теги: Додати тег
Немає тегів, Будьте першим, хто поставить тег для цього запису!
Назва журналу:Digital Library of Periodicals of National Academy of Sciences of Ukraine
Цитувати:Investigation of residual stresses in sapphire plates after grinding and polishing / A.T. Budnikov, E.A. Vovk, V.N. Kanishchev, S.I. Krivonogov // Functional Materials. — 2012. — Т. 19, № 4. — С. 478-482. — Бібліогр.: 14 назв. — англ.

Репозитарії

Digital Library of Periodicals of National Academy of Sciences of Ukraine
id irk-123456789-135375
record_format dspace
spelling irk-123456789-1353752018-06-16T03:09:06Z Investigation of residual stresses in sapphire plates after grinding and polishing Budnikov, A.T. Vovk, E.A. Kanishchev, V.N. Krivonogov, S.I. Characterization and properties The method of flexure determination was used to investigate the dependence of residual stresses on the depth of damaged layer in sapphire plates with a diameter of 100 mm after grinding and polishing. The flexure was determined from nonflatness of the control side of the plate using an interferometer of IT-200 type. The layer damaged in the process of grinding or polishing (of the tested side of the plate) was removed by chemico-mechanical polish. The removed value was established to an accuracy of 0.1 mg by weighing the plate before and after the treatment. The plate flexure was found to diminish with each removed layer, and to disappear after removal of 7 µm and 0.4 µm thick layer of the ground and polished samples, respectively. The most essential deformation caused by residual stresses was observed in the layers of the ground and polished plates with a thickness of 0.12-0.24 µm and 0.09-0.14 µm, respectively. 2012 Article Investigation of residual stresses in sapphire plates after grinding and polishing / A.T. Budnikov, E.A. Vovk, V.N. Kanishchev, S.I. Krivonogov // Functional Materials. — 2012. — Т. 19, № 4. — С. 478-482. — Бібліогр.: 14 назв. — англ. 1027-5495 http://dspace.nbuv.gov.ua/handle/123456789/135375 en Functional Materials НТК «Інститут монокристалів» НАН України
institution Digital Library of Periodicals of National Academy of Sciences of Ukraine
collection DSpace DC
language English
topic Characterization and properties
Characterization and properties
spellingShingle Characterization and properties
Characterization and properties
Budnikov, A.T.
Vovk, E.A.
Kanishchev, V.N.
Krivonogov, S.I.
Investigation of residual stresses in sapphire plates after grinding and polishing
Functional Materials
description The method of flexure determination was used to investigate the dependence of residual stresses on the depth of damaged layer in sapphire plates with a diameter of 100 mm after grinding and polishing. The flexure was determined from nonflatness of the control side of the plate using an interferometer of IT-200 type. The layer damaged in the process of grinding or polishing (of the tested side of the plate) was removed by chemico-mechanical polish. The removed value was established to an accuracy of 0.1 mg by weighing the plate before and after the treatment. The plate flexure was found to diminish with each removed layer, and to disappear after removal of 7 µm and 0.4 µm thick layer of the ground and polished samples, respectively. The most essential deformation caused by residual stresses was observed in the layers of the ground and polished plates with a thickness of 0.12-0.24 µm and 0.09-0.14 µm, respectively.
format Article
author Budnikov, A.T.
Vovk, E.A.
Kanishchev, V.N.
Krivonogov, S.I.
author_facet Budnikov, A.T.
Vovk, E.A.
Kanishchev, V.N.
Krivonogov, S.I.
author_sort Budnikov, A.T.
title Investigation of residual stresses in sapphire plates after grinding and polishing
title_short Investigation of residual stresses in sapphire plates after grinding and polishing
title_full Investigation of residual stresses in sapphire plates after grinding and polishing
title_fullStr Investigation of residual stresses in sapphire plates after grinding and polishing
title_full_unstemmed Investigation of residual stresses in sapphire plates after grinding and polishing
title_sort investigation of residual stresses in sapphire plates after grinding and polishing
publisher НТК «Інститут монокристалів» НАН України
publishDate 2012
topic_facet Characterization and properties
url http://dspace.nbuv.gov.ua/handle/123456789/135375
citation_txt Investigation of residual stresses in sapphire plates after grinding and polishing / A.T. Budnikov, E.A. Vovk, V.N. Kanishchev, S.I. Krivonogov // Functional Materials. — 2012. — Т. 19, № 4. — С. 478-482. — Бібліогр.: 14 назв. — англ.
series Functional Materials
work_keys_str_mv AT budnikovat investigationofresidualstressesinsapphireplatesaftergrindingandpolishing
AT vovkea investigationofresidualstressesinsapphireplatesaftergrindingandpolishing
AT kanishchevvn investigationofresidualstressesinsapphireplatesaftergrindingandpolishing
AT krivonogovsi investigationofresidualstressesinsapphireplatesaftergrindingandpolishing
first_indexed 2023-10-18T21:11:44Z
last_indexed 2023-10-18T21:11:44Z
_version_ 1796152178624167936