Investigation of residual stresses in sapphire plates after grinding and polishing
The method of flexure determination was used to investigate the dependence of residual stresses on the depth of damaged layer in sapphire plates with a diameter of 100 mm after grinding and polishing. The flexure was determined from nonflatness of the control side of the plate using an interferomete...
Збережено в:
Дата: | 2012 |
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Автори: | , , , |
Формат: | Стаття |
Мова: | English |
Опубліковано: |
НТК «Інститут монокристалів» НАН України
2012
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Назва видання: | Functional Materials |
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Онлайн доступ: | http://dspace.nbuv.gov.ua/handle/123456789/135375 |
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Назва журналу: | Digital Library of Periodicals of National Academy of Sciences of Ukraine |
Цитувати: | Investigation of residual stresses in sapphire plates after grinding and polishing / A.T. Budnikov, E.A. Vovk, V.N. Kanishchev, S.I. Krivonogov // Functional Materials. — 2012. — Т. 19, № 4. — С. 478-482. — Бібліогр.: 14 назв. — англ. |
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irk-123456789-1353752018-06-16T03:09:06Z Investigation of residual stresses in sapphire plates after grinding and polishing Budnikov, A.T. Vovk, E.A. Kanishchev, V.N. Krivonogov, S.I. Characterization and properties The method of flexure determination was used to investigate the dependence of residual stresses on the depth of damaged layer in sapphire plates with a diameter of 100 mm after grinding and polishing. The flexure was determined from nonflatness of the control side of the plate using an interferometer of IT-200 type. The layer damaged in the process of grinding or polishing (of the tested side of the plate) was removed by chemico-mechanical polish. The removed value was established to an accuracy of 0.1 mg by weighing the plate before and after the treatment. The plate flexure was found to diminish with each removed layer, and to disappear after removal of 7 µm and 0.4 µm thick layer of the ground and polished samples, respectively. The most essential deformation caused by residual stresses was observed in the layers of the ground and polished plates with a thickness of 0.12-0.24 µm and 0.09-0.14 µm, respectively. 2012 Article Investigation of residual stresses in sapphire plates after grinding and polishing / A.T. Budnikov, E.A. Vovk, V.N. Kanishchev, S.I. Krivonogov // Functional Materials. — 2012. — Т. 19, № 4. — С. 478-482. — Бібліогр.: 14 назв. — англ. 1027-5495 http://dspace.nbuv.gov.ua/handle/123456789/135375 en Functional Materials НТК «Інститут монокристалів» НАН України |
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Digital Library of Periodicals of National Academy of Sciences of Ukraine |
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English |
topic |
Characterization and properties Characterization and properties |
spellingShingle |
Characterization and properties Characterization and properties Budnikov, A.T. Vovk, E.A. Kanishchev, V.N. Krivonogov, S.I. Investigation of residual stresses in sapphire plates after grinding and polishing Functional Materials |
description |
The method of flexure determination was used to investigate the dependence of residual stresses on the depth of damaged layer in sapphire plates with a diameter of 100 mm after grinding and polishing. The flexure was determined from nonflatness of the control side of the plate using an interferometer of IT-200 type. The layer damaged in the process of grinding or polishing (of the tested side of the plate) was removed by chemico-mechanical polish. The removed value was established to an accuracy of 0.1 mg by weighing the plate before and after the treatment. The plate flexure was found to diminish with each removed layer, and to disappear after removal of 7 µm and 0.4 µm thick layer of the ground and polished samples, respectively. The most essential deformation caused by residual stresses was observed in the layers of the ground and polished plates with a thickness of 0.12-0.24 µm and 0.09-0.14 µm, respectively. |
format |
Article |
author |
Budnikov, A.T. Vovk, E.A. Kanishchev, V.N. Krivonogov, S.I. |
author_facet |
Budnikov, A.T. Vovk, E.A. Kanishchev, V.N. Krivonogov, S.I. |
author_sort |
Budnikov, A.T. |
title |
Investigation of residual stresses in sapphire plates after grinding and polishing |
title_short |
Investigation of residual stresses in sapphire plates after grinding and polishing |
title_full |
Investigation of residual stresses in sapphire plates after grinding and polishing |
title_fullStr |
Investigation of residual stresses in sapphire plates after grinding and polishing |
title_full_unstemmed |
Investigation of residual stresses in sapphire plates after grinding and polishing |
title_sort |
investigation of residual stresses in sapphire plates after grinding and polishing |
publisher |
НТК «Інститут монокристалів» НАН України |
publishDate |
2012 |
topic_facet |
Characterization and properties |
url |
http://dspace.nbuv.gov.ua/handle/123456789/135375 |
citation_txt |
Investigation of residual stresses in sapphire plates after grinding and polishing / A.T. Budnikov, E.A. Vovk, V.N. Kanishchev, S.I. Krivonogov // Functional Materials. — 2012. — Т. 19, № 4. — С. 478-482. — Бібліогр.: 14 назв. — англ. |
series |
Functional Materials |
work_keys_str_mv |
AT budnikovat investigationofresidualstressesinsapphireplatesaftergrindingandpolishing AT vovkea investigationofresidualstressesinsapphireplatesaftergrindingandpolishing AT kanishchevvn investigationofresidualstressesinsapphireplatesaftergrindingandpolishing AT krivonogovsi investigationofresidualstressesinsapphireplatesaftergrindingandpolishing |
first_indexed |
2023-10-18T21:11:44Z |
last_indexed |
2023-10-18T21:11:44Z |
_version_ |
1796152178624167936 |