Electrodeposition of copper indium diselenide films using pulse plating technique
Parameters of rectangular potential pulse electolysis wich have provided the obtaining of nearly stoichiometric copper indium diselenide layers have been selected using the examination of those films by energy-dispersive X-ray spectroscopy, anodic stripping, scanning electron microscopy and the film...
Збережено в:
| Дата: | 2007 |
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| Автор: | |
| Формат: | Стаття |
| Мова: | English |
| Опубліковано: |
НТК «Інститут монокристалів» НАН України
2007
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| Назва видання: | Functional Materials |
| Онлайн доступ: | http://dspace.nbuv.gov.ua/handle/123456789/136990 |
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| Назва журналу: | Digital Library of Periodicals of National Academy of Sciences of Ukraine |
| Цитувати: | Electrodeposition of copper indium diselenide films using pulse plating technique / N.P. Klochko // Functional Materials. — 2007. — Т. 14, № 3. — С. 343-346. — Бібліогр.: 9 назв. — англ. |
Репозитарії
Digital Library of Periodicals of National Academy of Sciences of Ukraine| Резюме: | Parameters of rectangular potential pulse electolysis wich have provided the obtaining of nearly stoichiometric copper indium diselenide layers have been selected using the examination of those films by energy-dispersive X-ray spectroscopy, anodic stripping, scanning electron microscopy and the film resistivity measurements. |
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