Heat localization and formation of secondary breakdown structure in semiconductor materials. III. Analysis of the one-dimensional model
Basing on the model before constructed that describes SB of thin semiconductor film included in an electronic circuit, the breakdown time and the localization size are estimated. These estimations are obtained in the frame of the one-dimensional model basing on the parabolic equations maximum princi...
Збережено в:
| Дата: | 2004 |
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| Автори: | , |
| Формат: | Стаття |
| Мова: | English |
| Опубліковано: |
НТК «Інститут монокристалів» НАН України
2004
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| Назва видання: | Functional Materials |
| Онлайн доступ: | http://dspace.nbuv.gov.ua/handle/123456789/138794 |
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| Назва журналу: | Digital Library of Periodicals of National Academy of Sciences of Ukraine |
| Цитувати: | Heat localization and formation of secondary breakdown structure in semiconductor materials. III. Analysis of the one-dimensional model / Yu.P.Virchenko, A.A.Vodyanitskii // Functional Materials. — 2004. — Т. 11, № 2. — С. 236-240. — англ. |
Репозитарії
Digital Library of Periodicals of National Academy of Sciences of Ukraine| Резюме: | Basing on the model before constructed that describes SB of thin semiconductor film included in an electronic circuit, the breakdown time and the localization size are estimated. These estimations are obtained in the frame of the one-dimensional model basing on the parabolic equations maximum principle using some standard solutions with the sharpening. |
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