Dynamic Stress Intensity Factor for Interfacial Cracks of Mode III Emanating from Circular Cavities in Piezoelectric Bimaterials
This paper investigates dynamic stress intensity factors in piezoelectric bimaterials with interfacial cracks emanating from the circular cavities under steady SH-waves. The interfacial cracks are assumed to be permeable. Green functions for the experiment were constructed through complex variable a...
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| Дата: | 2016 |
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| Автори: | , , |
| Формат: | Стаття |
| Мова: | English |
| Опубліковано: |
Інститут проблем міцності ім. Г.С. Писаренко НАН України
2016
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| Назва видання: | Проблемы прочности |
| Теми: | |
| Онлайн доступ: | http://dspace.nbuv.gov.ua/handle/123456789/173417 |
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| Назва журналу: | Digital Library of Periodicals of National Academy of Sciences of Ukraine |
| Цитувати: | Dynamic Stress Intensity Factor for Interfacial Cracks of Mode III Emanating from Circular Cavities in Piezoelectric Bimaterials / D. Li, H.C. Wang, L.X. Wu // Проблемы прочности. — 2016. — № 1. — С. 58-68. — Бібліогр.: 13 назв. — англ. |
Репозитарії
Digital Library of Periodicals of National Academy of Sciences of Ukraine| id |
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irk-123456789-1734172020-12-04T01:26:30Z Dynamic Stress Intensity Factor for Interfacial Cracks of Mode III Emanating from Circular Cavities in Piezoelectric Bimaterials Li, D. Wang, H.C. Wu, L.X. Научно-технический раздел This paper investigates dynamic stress intensity factors in piezoelectric bimaterials with interfacial cracks emanating from the circular cavities under steady SH-waves. The interfacial cracks are assumed to be permeable. Green functions for the experiment were constructed through complex variable and wave function expansion methods. Based on the crack-division and conjunction techniques, a series of Fredholm integral equations of the first kind were established to calculate the stress intensity of the crack tips. Direct numerical integration was used to solve the equations. Some numerical results were plotted to indicate the influence of the defect geometry, material constants, and SH-wave frequencies on dynamic stress intensity factors. 2016 Article Dynamic Stress Intensity Factor for Interfacial Cracks of Mode III Emanating from Circular Cavities in Piezoelectric Bimaterials / D. Li, H.C. Wang, L.X. Wu // Проблемы прочности. — 2016. — № 1. — С. 58-68. — Бібліогр.: 13 назв. — англ. 0556-171X http://dspace.nbuv.gov.ua/handle/123456789/173417 539.4 en Проблемы прочности Інститут проблем міцності ім. Г.С. Писаренко НАН України |
| institution |
Digital Library of Periodicals of National Academy of Sciences of Ukraine |
| collection |
DSpace DC |
| language |
English |
| topic |
Научно-технический раздел Научно-технический раздел |
| spellingShingle |
Научно-технический раздел Научно-технический раздел Li, D. Wang, H.C. Wu, L.X. Dynamic Stress Intensity Factor for Interfacial Cracks of Mode III Emanating from Circular Cavities in Piezoelectric Bimaterials Проблемы прочности |
| description |
This paper investigates dynamic stress intensity factors in piezoelectric bimaterials with interfacial cracks emanating from the circular cavities under steady SH-waves. The interfacial cracks are assumed to be permeable. Green functions for the experiment were constructed through complex variable and wave function expansion methods. Based on the crack-division and conjunction techniques, a series of Fredholm integral equations of the first kind were established to calculate the stress intensity of the crack tips. Direct numerical integration was used to solve the equations. Some numerical results were plotted to indicate the influence of the defect geometry, material constants, and SH-wave frequencies on dynamic stress intensity factors. |
| format |
Article |
| author |
Li, D. Wang, H.C. Wu, L.X. |
| author_facet |
Li, D. Wang, H.C. Wu, L.X. |
| author_sort |
Li, D. |
| title |
Dynamic Stress Intensity Factor for Interfacial Cracks of Mode III Emanating from Circular Cavities in Piezoelectric Bimaterials |
| title_short |
Dynamic Stress Intensity Factor for Interfacial Cracks of Mode III Emanating from Circular Cavities in Piezoelectric Bimaterials |
| title_full |
Dynamic Stress Intensity Factor for Interfacial Cracks of Mode III Emanating from Circular Cavities in Piezoelectric Bimaterials |
| title_fullStr |
Dynamic Stress Intensity Factor for Interfacial Cracks of Mode III Emanating from Circular Cavities in Piezoelectric Bimaterials |
| title_full_unstemmed |
Dynamic Stress Intensity Factor for Interfacial Cracks of Mode III Emanating from Circular Cavities in Piezoelectric Bimaterials |
| title_sort |
dynamic stress intensity factor for interfacial cracks of mode iii emanating from circular cavities in piezoelectric bimaterials |
| publisher |
Інститут проблем міцності ім. Г.С. Писаренко НАН України |
| publishDate |
2016 |
| topic_facet |
Научно-технический раздел |
| url |
http://dspace.nbuv.gov.ua/handle/123456789/173417 |
| citation_txt |
Dynamic Stress Intensity Factor for Interfacial Cracks of Mode III Emanating from Circular Cavities in Piezoelectric Bimaterials / D. Li, H.C. Wang, L.X. Wu // Проблемы прочности. — 2016. — № 1. — С. 58-68. — Бібліогр.: 13 назв. — англ. |
| series |
Проблемы прочности |
| work_keys_str_mv |
AT lid dynamicstressintensityfactorforinterfacialcracksofmodeiiiemanatingfromcircularcavitiesinpiezoelectricbimaterials AT wanghc dynamicstressintensityfactorforinterfacialcracksofmodeiiiemanatingfromcircularcavitiesinpiezoelectricbimaterials AT wulx dynamicstressintensityfactorforinterfacialcracksofmodeiiiemanatingfromcircularcavitiesinpiezoelectricbimaterials |
| first_indexed |
2023-10-18T22:34:03Z |
| last_indexed |
2023-10-18T22:34:03Z |
| _version_ |
1796155854860320768 |