Modern technologies of soldering, providing increased strength and ductility of metal joints
Sometimes, the operations of electronic devices have failures due to lack of
 strength and ductility of the metal solder joints. As known, a main condition
 for ensuring of the required strength and ductility of the metal compounds is
 the choice of optimal brazing temperatur...
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| Veröffentlicht in: | Металлофизика и новейшие технологии |
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| Datum: | 2013 |
| Hauptverfasser: | , |
| Format: | Artikel |
| Sprache: | Englisch |
| Veröffentlicht: |
Інститут металофізики ім. Г.В. Курдюмова НАН України
2013
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| Schlagworte: | |
| Online Zugang: | https://nasplib.isofts.kiev.ua/handle/123456789/104271 |
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| Назва журналу: | Digital Library of Periodicals of National Academy of Sciences of Ukraine |
| Zitieren: | Modern technologies of soldering, providing increased strength and ductility of metal joints / V.N. Shtennikov, B.T. Budai // Металлофизика и новейшие технологии. — 2013. — Т. 35, № 12. — С. 1725-1731. — Бібліогр.: 7 назв. — англ. |