Modern technologies of soldering, providing increased strength and ductility of metal joints

• Veröffentlicht in: Металлофизика и новейшие технологии
• Datum: 2013
• Hauptverfasser: Shtennikov, V.N., Budai, B.T.
• Format: Artikel
• Sprache: Englisch
• Veröffentlicht: Інститут металофізики ім. Г.В. Курдюмова НАН України 2013
• Schlagworte: Физика прочности и пластичности
• Online Zugang: https://nasplib.isofts.kiev.ua/handle/123456789/104271
• Назва журналу: Digital Library of Periodicals of National Academy of Sciences of Ukraine
• Zitieren: Modern technologies of soldering, providing increased strength and ductility of metal joints / V.N. Shtennikov, B.T. Budai // Металлофизика и новейшие технологии. — 2013. — Т. 35, № 12. — С. 1725-1731. — Бібліогр.: 7 назв. — англ.

Sometimes, the operations of electronic devices have failures due to lack of
 strength and ductility of the metal solder joints. As known, a main condition
 for ensuring of the required strength and ductility of the metal compounds is
 the choice of optimal brazing temperatur...