Новы книги
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| Date: | 2016 |
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| Format: | Article |
| Language: | Russian |
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Інститут фізики напівпровідників імені В.Є. Лашкарьова НАН України
2016
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| Series: | Технология и конструирование в электронной аппаратуре |
| Online Access: | https://nasplib.isofts.kiev.ua/handle/123456789/115728 |
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| Journal Title: | Digital Library of Periodicals of National Academy of Sciences of Ukraine |
| Cite this: | Новы книги // Технология и конструирование в электронной аппаратуре. — 2016. — № 6. — С. 35. — рос. |
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nasplib_isofts_kiev_ua-123456789-1157282025-02-23T19:28:26Z Новы книги 2016 Article Новы книги // Технология и конструирование в электронной аппаратуре. — 2016. — № 6. — С. 35. — рос. 2225-5818 https://nasplib.isofts.kiev.ua/handle/123456789/115728 ru Технология и конструирование в электронной аппаратуре application/pdf Інститут фізики напівпровідників імені В.Є. Лашкарьова НАН України |
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Новы книги |
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Новы книги Технология и конструирование в электронной аппаратуре |
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Новы книги |
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Новы книги |
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Новы книги |
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новы книги |
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Інститут фізики напівпровідників імені В.Є. Лашкарьова НАН України |
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Новы книги // Технология и конструирование в электронной аппаратуре. — 2016. — № 6. — С. 35. — рос. |
| series |
Технология и конструирование в электронной аппаратуре |
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2025-11-24T16:04:13Z |
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Òåõíîëîãèÿ è êîíñòðóèðîâàíèå â ýëåêòðîííîé àïïàðàòóðå, 2016, ¹ 6
35
ÎÁÅÑÏÅЧÅÍÈÅ ÒÅÏËÎÂÛÕ ÐÅÆÈÌÎÂ
ISSN 2225-5818
REFERENCES
1. Spokoiny M., Trofimov V. Collider jets cooling
method of microprocessors. Proc. of the 2011 International
Microelectronics and Packaging Society ATW on Thermal
Management, Session 12 “Liquid, phase-change and refrig-
eration cooling”. Palo Alto, CA, USA, November 7-9, 2011,
pp. 1-18.
2. Spokoiny M., Trofimov V., Qiu Х., Kerner J.M.
Enhanced heat transfer in a channel with combined structure
of pins and dimples // Proc. of the 9th AIAA/ASME Joint
Thermophysics and Heat Transfer Conference, San Francisco,
CA, USA, 2006, pp. 1-21.
3. Bulavin L.A., Aktan O.Yu., Nikolaienko T.Yu.,
Nikolaienko Yu.E. [Experimental examination of a temperature
field of a heat sink cooler]. Tekhnologiya i konstruirovanie v
elektronnoi apparature. 2006. no 5, pp. 61-64. (Rus)
4. Pismenniy E. N., Rogachev V. A., Baranjuk A. V.,
Tcvyachenko E. V. [Thermal efficiency of with plate-cut fins
in conditions low speed to blow]. Tekhnologiya i konstru-
irovanie v elektronnoi apparature. 2005, no 4, pp. 43-45 (Rus)
5. Rassamakin B. M., Rogachev V. A., Khayrnasov S. M.
[Coolers based on heat pipes for thermally loaded devices of
personal computers]. Tekhnologiya i konstruirovanie v elek-
tronnoi apparature. 2006, no 4, pp. 48-50. (Rus)
6. Spokoiny Ju.E., Trofimov V.E., Olibash G.V. [The
choice of constructional parameters of heat radiators for LSIC
jet impact cooling]. Tekhnologiya i konstruirovanie v elektron-
noi apparature. 1998, no 1, pp. 18-19. (Rus)
7. Spokoyny Ju.E., Trofimov V. E., Olibash G. V. [The
designing of heat radiators for IC with jet impact air
cooling]. Tekhnologiya i konstruirovanie v elektronnoi ap-
parature. 1998, no 2, pp. 17-19. (Rus)
8. Berezuts`kii V.V. [Fundamentals of labor protection].
Kharkov, Fact, 2007, 241 p. (Rus)
9. Trofimov V. E., Pavlov A. L., Zhmud E. V.
[Visualization of the interaction of a jet with a dead-end
cavity of the radiator for liquid cooling of a microprocessor].
Proc. of the 16th International scientific-practical conference
“Modern information and electronic technologies”, Ukraine,
Odessa, 2015, pp. 160-161. (Rus)
High density PCB layout, the requirement of free access to the jumpers and interfaces, and the presence of
numerous sensors limit the space for radiator mounting and require the use of an extremely compact radiator,
especially in air cooling conditions. One of the possible solutions for this problem may reduce the area of the
radiator heat-transfer surfaces due to a sharp growth of the heat transfer coefficient without increasing the air
flow rate. To ensure a sharp growth of heat transfer coefficient on the heat-transfer surface one should make
in the surface one or more dead-end cavities into which the impact air jets would flow.
CFD simulation of this type of radiator has been conducted. The heat-aerodynamic characteristics and design
recommendations for removing heat from microprocessors in a limited space have been determined.
Keywords: CFD-modeling, radiator, heat resistance, impact jet, microprocessor.
ÍÎÂÛÅ ÊÍÈÃÈ
Зайков Â. Ï., Ìещеряков Â. È., Æуравлёв Ю. È. Ïрогнозирование показа-
телей надежности термоэлектрических охлаждающих устройств. Книга 2.
Каскадные устройства.— Îдесса: Ïолитехпериодика, 2016.— 124 с.
Êíèãà ïîñâÿщåíà ïðîãíîзèðîâàíèю ïîêàзàòåëåé íàдåжíîñòè êàñêàдíыõ
òåðмîýëåêòðèчåñêèõ óñòðîéñòâ (ÊÒЭÓ) ïðè èõ ïðîåêòèðîâàíèè è îцåíêå
ïîêàзàòåëåé íàдåжíîñòè ÊÒЭÓ âыбðàííîé êîíñòðóêцèè.
Рàññмîòðåíы фóíêцèîíàëьíыå зàâèñèмîñòè, ïîзâîëÿющèå îцåíèòь êàê
îõëàждàющèå âîзмîжíîñòè, òàê è ýíåðãåòèчåñêóю ýффåêòèâíîñòь è ïîêà-
зàòåëè íàдåжíîñòè ïðîåêòèðóåмîãî óñòðîéñòâà â ðàзëèчíыõ òîêîâыõ ðåжè-
мàõ ðàбîòы. Пðîдåмîíñòðèðîâàí ïîдõîд, ïîзâîëÿющèé ïåðåéòè îò ðàñчå-
òîâ ê ïîñòðîåíèю êàñêàдíыõ ÒЭÓ íà îñíîâå óíèфèцèðîâàííыõ мîдóëåé, è
ïîдõîд, êîòîðыé ïîзâîëÿåò îцåíèòь ïîêàзàòåëè íàдåжíîñòè ÊÒЭÓ зàдàí-
íîé êîíñòðóêцèè. Пðîàíàëèзèðîâàíî âëèÿíèå òåïëîâîé íàãðóзêè íà ïàðà-
мåòðы íàдåжíîñòè ÊÒЭÓ. Пðèâåдåíы àëãîðèòмы, êîòîðыå ïîмîãóò ðàз-
ðàбîòчèêó âåñòè îïòèмèзèðîâàííîå ïðîåêòèðîâàíèå РЭА ñ èñïîëьзîâàíè-
åм ÊÒЭÓ èëè âыбðàòь îïòèмàëьíóю дëÿ ïîñòàâëåííîé зàдàчè êîíñòðóê-
цèю ÊÒЭÓ.
Пðåдíàзíàчåíà дëÿ èíжåíåðîâ, íàóчíыõ ðàбîòíèêîâ, à òàêжå ñòóдåí-
òîâ ñîîòâåòñòâóющèõ ñïåцèàëьíîñòåé, зàíèмàющèõñÿ âîïðîñàмè íàдåжíî-
ñòè ýëåмåíòîâ ýëåêòðîíèêè è â цåëîм РЭА, à òàêжå ðàзðàбîòêîé è ïðîåê-
òèðîâàíèåм òåðмîýëåêòðèчåñêèõ óñòðîéñòâ.
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