Low-temperature deposition of silicon dioxide films in high-density plasma

One of the basic operations in the LED (light-emitting diode) chip fabrication
 technique is formation of dielectric coatings for the purpose of insulation and surface
 passivation of the LED structure. Oxides and nitrides of silicon obtained by physical or
 chemical vapor de...

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Published in:Semiconductor Physics Quantum Electronics & Optoelectronics
Date:2013
Main Authors: Yasunas, A., Kotov, D., Shiripov, V., Radzionay, U.
Format: Article
Language:English
Published: Інститут фізики напівпровідників імені В.Є. Лашкарьова НАН України 2013
Online Access:https://nasplib.isofts.kiev.ua/handle/123456789/117696
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Journal Title:Digital Library of Periodicals of National Academy of Sciences of Ukraine
Cite this:Low-temperature deposition of silicon dioxide films
 in high-density plasma / A. Yasunas, D. Kotov, V. Shiripov, U. Radzionay // Semiconductor Physics Quantum Electronics & Optoelectronics. — 2013. — Т. 16, № 2. — С. 216-219. — Бібліогр.: 2 назв. — англ.

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Digital Library of Periodicals of National Academy of Sciences of Ukraine
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author Yasunas, A.
Kotov, D.
Shiripov, V.
Radzionay, U.
author_facet Yasunas, A.
Kotov, D.
Shiripov, V.
Radzionay, U.
citation_txt Low-temperature deposition of silicon dioxide films
 in high-density plasma / A. Yasunas, D. Kotov, V. Shiripov, U. Radzionay // Semiconductor Physics Quantum Electronics & Optoelectronics. — 2013. — Т. 16, № 2. — С. 216-219. — Бібліогр.: 2 назв. — англ.
collection DSpace DC
container_title Semiconductor Physics Quantum Electronics & Optoelectronics
description One of the basic operations in the LED (light-emitting diode) chip fabrication
 technique is formation of dielectric coatings for the purpose of insulation and surface
 passivation of the LED structure. Oxides and nitrides of silicon obtained by physical or
 chemical vapor deposition techniques can act as such a coating. Low conformity of
 physical vapor deposition techniques limits the possibility of their application in a
 number of cases at LED mesostructures passivation. This work represents the results of
 experiments on silicon dioxide dielectric films deposition in the inductive coupled
 plasma under different operation conditions. The findings prove the possibility of lowtemperature
 deposition of thick silicon dioxide films with high conformality by the
 HDPCVD (high-density plasma chemical vapor deposition) technique.
first_indexed 2025-11-29T10:35:24Z
format Article
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id nasplib_isofts_kiev_ua-123456789-117696
institution Digital Library of Periodicals of National Academy of Sciences of Ukraine
issn 1560-8034
language English
last_indexed 2025-11-29T10:35:24Z
publishDate 2013
publisher Інститут фізики напівпровідників імені В.Є. Лашкарьова НАН України
record_format dspace
spelling Yasunas, A.
Kotov, D.
Shiripov, V.
Radzionay, U.
2017-05-26T10:11:01Z
2017-05-26T10:11:01Z
2013
Low-temperature deposition of silicon dioxide films
 in high-density plasma / A. Yasunas, D. Kotov, V. Shiripov, U. Radzionay // Semiconductor Physics Quantum Electronics & Optoelectronics. — 2013. — Т. 16, № 2. — С. 216-219. — Бібліогр.: 2 назв. — англ.
1560-8034
PACS 78.20.-e, 82.33.Xj
https://nasplib.isofts.kiev.ua/handle/123456789/117696
One of the basic operations in the LED (light-emitting diode) chip fabrication
 technique is formation of dielectric coatings for the purpose of insulation and surface
 passivation of the LED structure. Oxides and nitrides of silicon obtained by physical or
 chemical vapor deposition techniques can act as such a coating. Low conformity of
 physical vapor deposition techniques limits the possibility of their application in a
 number of cases at LED mesostructures passivation. This work represents the results of
 experiments on silicon dioxide dielectric films deposition in the inductive coupled
 plasma under different operation conditions. The findings prove the possibility of lowtemperature
 deposition of thick silicon dioxide films with high conformality by the
 HDPCVD (high-density plasma chemical vapor deposition) technique.
en
Інститут фізики напівпровідників імені В.Є. Лашкарьова НАН України
Semiconductor Physics Quantum Electronics & Optoelectronics
Low-temperature deposition of silicon dioxide films in high-density plasma
Article
published earlier
spellingShingle Low-temperature deposition of silicon dioxide films in high-density plasma
Yasunas, A.
Kotov, D.
Shiripov, V.
Radzionay, U.
title Low-temperature deposition of silicon dioxide films in high-density plasma
title_full Low-temperature deposition of silicon dioxide films in high-density plasma
title_fullStr Low-temperature deposition of silicon dioxide films in high-density plasma
title_full_unstemmed Low-temperature deposition of silicon dioxide films in high-density plasma
title_short Low-temperature deposition of silicon dioxide films in high-density plasma
title_sort low-temperature deposition of silicon dioxide films in high-density plasma
url https://nasplib.isofts.kiev.ua/handle/123456789/117696
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AT kotovd lowtemperaturedepositionofsilicondioxidefilmsinhighdensityplasma
AT shiripovv lowtemperaturedepositionofsilicondioxidefilmsinhighdensityplasma
AT radzionayu lowtemperaturedepositionofsilicondioxidefilmsinhighdensityplasma