Low-temperature deposition of silicon dioxide films in high-density plasma

One of the basic operations in the LED (light-emitting diode) chip fabrication technique is formation of dielectric coatings for the purpose of insulation and surface passivation of the LED structure. Oxides and nitrides of silicon obtained by physical or chemical vapor deposition techniques can...

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Veröffentlicht in:Semiconductor Physics Quantum Electronics & Optoelectronics
Datum:2013
Hauptverfasser: Yasunas, A., Kotov, D., Shiripov, V., Radzionay, U.
Format: Artikel
Sprache:English
Veröffentlicht: Інститут фізики напівпровідників імені В.Є. Лашкарьова НАН України 2013
Online Zugang:https://nasplib.isofts.kiev.ua/handle/123456789/117696
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Назва журналу:Digital Library of Periodicals of National Academy of Sciences of Ukraine
Zitieren:Low-temperature deposition of silicon dioxide films in high-density plasma / A. Yasunas, D. Kotov, V. Shiripov, U. Radzionay // Semiconductor Physics Quantum Electronics & Optoelectronics. — 2013. — Т. 16, № 2. — С. 216-219. — Бібліогр.: 2 назв. — англ.

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Digital Library of Periodicals of National Academy of Sciences of Ukraine
id nasplib_isofts_kiev_ua-123456789-117696
record_format dspace
spelling Yasunas, A.
Kotov, D.
Shiripov, V.
Radzionay, U.
2017-05-26T10:11:01Z
2017-05-26T10:11:01Z
2013
Low-temperature deposition of silicon dioxide films in high-density plasma / A. Yasunas, D. Kotov, V. Shiripov, U. Radzionay // Semiconductor Physics Quantum Electronics & Optoelectronics. — 2013. — Т. 16, № 2. — С. 216-219. — Бібліогр.: 2 назв. — англ.
1560-8034
PACS 78.20.-e, 82.33.Xj
https://nasplib.isofts.kiev.ua/handle/123456789/117696
One of the basic operations in the LED (light-emitting diode) chip fabrication technique is formation of dielectric coatings for the purpose of insulation and surface passivation of the LED structure. Oxides and nitrides of silicon obtained by physical or chemical vapor deposition techniques can act as such a coating. Low conformity of physical vapor deposition techniques limits the possibility of their application in a number of cases at LED mesostructures passivation. This work represents the results of experiments on silicon dioxide dielectric films deposition in the inductive coupled plasma under different operation conditions. The findings prove the possibility of lowtemperature deposition of thick silicon dioxide films with high conformality by the HDPCVD (high-density plasma chemical vapor deposition) technique.
en
Інститут фізики напівпровідників імені В.Є. Лашкарьова НАН України
Semiconductor Physics Quantum Electronics & Optoelectronics
Low-temperature deposition of silicon dioxide films in high-density plasma
Article
published earlier
institution Digital Library of Periodicals of National Academy of Sciences of Ukraine
collection DSpace DC
title Low-temperature deposition of silicon dioxide films in high-density plasma
spellingShingle Low-temperature deposition of silicon dioxide films in high-density plasma
Yasunas, A.
Kotov, D.
Shiripov, V.
Radzionay, U.
title_short Low-temperature deposition of silicon dioxide films in high-density plasma
title_full Low-temperature deposition of silicon dioxide films in high-density plasma
title_fullStr Low-temperature deposition of silicon dioxide films in high-density plasma
title_full_unstemmed Low-temperature deposition of silicon dioxide films in high-density plasma
title_sort low-temperature deposition of silicon dioxide films in high-density plasma
author Yasunas, A.
Kotov, D.
Shiripov, V.
Radzionay, U.
author_facet Yasunas, A.
Kotov, D.
Shiripov, V.
Radzionay, U.
publishDate 2013
language English
container_title Semiconductor Physics Quantum Electronics & Optoelectronics
publisher Інститут фізики напівпровідників імені В.Є. Лашкарьова НАН України
format Article
description One of the basic operations in the LED (light-emitting diode) chip fabrication technique is formation of dielectric coatings for the purpose of insulation and surface passivation of the LED structure. Oxides and nitrides of silicon obtained by physical or chemical vapor deposition techniques can act as such a coating. Low conformity of physical vapor deposition techniques limits the possibility of their application in a number of cases at LED mesostructures passivation. This work represents the results of experiments on silicon dioxide dielectric films deposition in the inductive coupled plasma under different operation conditions. The findings prove the possibility of lowtemperature deposition of thick silicon dioxide films with high conformality by the HDPCVD (high-density plasma chemical vapor deposition) technique.
issn 1560-8034
url https://nasplib.isofts.kiev.ua/handle/123456789/117696
citation_txt Low-temperature deposition of silicon dioxide films in high-density plasma / A. Yasunas, D. Kotov, V. Shiripov, U. Radzionay // Semiconductor Physics Quantum Electronics & Optoelectronics. — 2013. — Т. 16, № 2. — С. 216-219. — Бібліогр.: 2 назв. — англ.
work_keys_str_mv AT yasunasa lowtemperaturedepositionofsilicondioxidefilmsinhighdensityplasma
AT kotovd lowtemperaturedepositionofsilicondioxidefilmsinhighdensityplasma
AT shiripovv lowtemperaturedepositionofsilicondioxidefilmsinhighdensityplasma
AT radzionayu lowtemperaturedepositionofsilicondioxidefilmsinhighdensityplasma
first_indexed 2025-11-29T10:35:24Z
last_indexed 2025-11-29T10:35:24Z
_version_ 1850854791449673728