The features of temperature dependence of contact resistivity of Au-Ti-Pd₂Si-p⁺ ₋Si ohmic contacts

We consider the features of formation of Au-Ti-Pd ohmic contacts to p⁺₋Si.
 Metallization was made by vacuum thermal sputtering of Pd, Ti and Au films onto the Si
 substrate heated up to 330 °С. It is shown that the contact resistivity increases with
 temperature; this is typ...

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Опубліковано в: :Semiconductor Physics Quantum Electronics & Optoelectronics
Дата:2010
Автори: Belyaev, A.E., Boltovets, N.S., Kapitanchuk, L.M., Konakova, R.V., Kladko, V.P., Kudryk, Ya.Ya., Kuchuk, A.V., Lytvyn, O.S., Milenin, V.V., Korostinskaya, T.V., Ataubaeva, A.B., Nevolin, P.V.
Формат: Стаття
Мова:Англійська
Опубліковано: Інститут фізики напівпровідників імені В.Є. Лашкарьова НАН України 2010
Онлайн доступ:https://nasplib.isofts.kiev.ua/handle/123456789/117698
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Цитувати:The features of temperature dependence of contact resistivity of Au-Ti-Pd₂Si-p⁺ ₋Si ohmic contacts /A.E. Belyaev, N.S. Boltovets, L.M. Kapitanchuk, R.V. Konakova, V.P. Kladko, Ya.Ya. Kudryk, A.V. Kuchuk, O.S. Lytvyn, V.V. Milenin, T.V. Korostinskaya, A.B. Ataubaeva, P.V. Nevolin // Semiconductor Physics Quantum Electronics & Optoelectronics. — 2010. — Т. 13, № 1. — С. 8-11. — Бібліогр.: 14 назв. — англ.

Репозитарії

Digital Library of Periodicals of National Academy of Sciences of Ukraine
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author Belyaev, A.E.
Boltovets, N.S.
Kapitanchuk, L.M.
Konakova, R.V.
Kladko, V.P.
Kudryk, Ya.Ya.
Kuchuk, A.V.
Lytvyn, O.S.
Milenin, V.V.
Korostinskaya, T.V.
Ataubaeva, A.B.
Nevolin, P.V.
author_facet Belyaev, A.E.
Boltovets, N.S.
Kapitanchuk, L.M.
Konakova, R.V.
Kladko, V.P.
Kudryk, Ya.Ya.
Kuchuk, A.V.
Lytvyn, O.S.
Milenin, V.V.
Korostinskaya, T.V.
Ataubaeva, A.B.
Nevolin, P.V.
citation_txt The features of temperature dependence of contact resistivity of Au-Ti-Pd₂Si-p⁺ ₋Si ohmic contacts /A.E. Belyaev, N.S. Boltovets, L.M. Kapitanchuk, R.V. Konakova, V.P. Kladko, Ya.Ya. Kudryk, A.V. Kuchuk, O.S. Lytvyn, V.V. Milenin, T.V. Korostinskaya, A.B. Ataubaeva, P.V. Nevolin // Semiconductor Physics Quantum Electronics & Optoelectronics. — 2010. — Т. 13, № 1. — С. 8-11. — Бібліогр.: 14 назв. — англ.
collection DSpace DC
container_title Semiconductor Physics Quantum Electronics & Optoelectronics
description We consider the features of formation of Au-Ti-Pd ohmic contacts to p⁺₋Si.
 Metallization was made by vacuum thermal sputtering of Pd, Ti and Au films onto the Si
 substrate heated up to 330 °С. It is shown that the contact resistivity increases with
 temperature; this is typical of metallic conductivity. We suggest that the ohmic contact is
 formed owing to appearance of shunts at Pd deposition on dislocations or other structural
 defects. The number of shunts per unit area is close to the measured density of structural
 defects at the metal-Si interface.
first_indexed 2025-12-01T20:33:57Z
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language English
last_indexed 2025-12-01T20:33:57Z
publishDate 2010
publisher Інститут фізики напівпровідників імені В.Є. Лашкарьова НАН України
record_format dspace
spelling Belyaev, A.E.
Boltovets, N.S.
Kapitanchuk, L.M.
Konakova, R.V.
Kladko, V.P.
Kudryk, Ya.Ya.
Kuchuk, A.V.
Lytvyn, O.S.
Milenin, V.V.
Korostinskaya, T.V.
Ataubaeva, A.B.
Nevolin, P.V.
2017-05-26T12:07:14Z
2017-05-26T12:07:14Z
2010
The features of temperature dependence of contact resistivity of Au-Ti-Pd₂Si-p⁺ ₋Si ohmic contacts /A.E. Belyaev, N.S. Boltovets, L.M. Kapitanchuk, R.V. Konakova, V.P. Kladko, Ya.Ya. Kudryk, A.V. Kuchuk, O.S. Lytvyn, V.V. Milenin, T.V. Korostinskaya, A.B. Ataubaeva, P.V. Nevolin // Semiconductor Physics Quantum Electronics & Optoelectronics. — 2010. — Т. 13, № 1. — С. 8-11. — Бібліогр.: 14 назв. — англ.
1560-8034
PACS 85.30.De
https://nasplib.isofts.kiev.ua/handle/123456789/117698
We consider the features of formation of Au-Ti-Pd ohmic contacts to p⁺₋Si.
 Metallization was made by vacuum thermal sputtering of Pd, Ti and Au films onto the Si
 substrate heated up to 330 °С. It is shown that the contact resistivity increases with
 temperature; this is typical of metallic conductivity. We suggest that the ohmic contact is
 formed owing to appearance of shunts at Pd deposition on dislocations or other structural
 defects. The number of shunts per unit area is close to the measured density of structural
 defects at the metal-Si interface.
This work was supported by the Government Goaloriented
 Scientific and Technical Program “The development and acquisition of microelectronic
 technologies, organization of serial production of devices and systems with them” 2008-2011. Decree of the Cabinet of Ministers of Ukraine No 1335 from November 21, 2007.
en
Інститут фізики напівпровідників імені В.Є. Лашкарьова НАН України
Semiconductor Physics Quantum Electronics & Optoelectronics
The features of temperature dependence of contact resistivity of Au-Ti-Pd₂Si-p⁺ ₋Si ohmic contacts
Article
published earlier
spellingShingle The features of temperature dependence of contact resistivity of Au-Ti-Pd₂Si-p⁺ ₋Si ohmic contacts
Belyaev, A.E.
Boltovets, N.S.
Kapitanchuk, L.M.
Konakova, R.V.
Kladko, V.P.
Kudryk, Ya.Ya.
Kuchuk, A.V.
Lytvyn, O.S.
Milenin, V.V.
Korostinskaya, T.V.
Ataubaeva, A.B.
Nevolin, P.V.
title The features of temperature dependence of contact resistivity of Au-Ti-Pd₂Si-p⁺ ₋Si ohmic contacts
title_full The features of temperature dependence of contact resistivity of Au-Ti-Pd₂Si-p⁺ ₋Si ohmic contacts
title_fullStr The features of temperature dependence of contact resistivity of Au-Ti-Pd₂Si-p⁺ ₋Si ohmic contacts
title_full_unstemmed The features of temperature dependence of contact resistivity of Au-Ti-Pd₂Si-p⁺ ₋Si ohmic contacts
title_short The features of temperature dependence of contact resistivity of Au-Ti-Pd₂Si-p⁺ ₋Si ohmic contacts
title_sort features of temperature dependence of contact resistivity of au-ti-pd₂si-p⁺ ₋si ohmic contacts
url https://nasplib.isofts.kiev.ua/handle/123456789/117698
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