Genesis of initial defects in the process of monocrystalline silicon oxidation with subsequent scribing

The type, density, and distribution of defects in initial and oxidated
 monocrystalline silicon wafers were studied by modern methods. It was established that
 disordered silicon and stacking faults are basic defects in near-surface layers of oxidated
 monocrystalline silicon...

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Veröffentlicht in:Semiconductor Physics Quantum Electronics & Optoelectronics
Datum:2010
ISSN:1560-8034
Hauptverfasser: Smyntyna, V.A., Sviridova, O.V.
Format: Artikel
Sprache:Englisch
Veröffentlicht: Інститут фізики напівпровідників імені В.Є. Лашкарьова НАН України 2010
Online Zugang:https://nasplib.isofts.kiev.ua/handle/123456789/117746
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Назва журналу:Digital Library of Periodicals of National Academy of Sciences of Ukraine
Zitieren:Genesis of initial defects in the process of monocrystalline silicon oxidation with subsequent scribing/ V.A. Smyntyna and O.V. Sviridova // Semiconductor Physics Quantum Electronics & Optoelectronics. — 2010. — Т. 13, № 1. — С. 74-78. — Бібліогр.: 17 назв. — англ.

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Digital Library of Periodicals of National Academy of Sciences of Ukraine
Beschreibung
Zusammenfassung:The type, density, and distribution of defects in initial and oxidated
 monocrystalline silicon wafers were studied by modern methods. It was established that
 disordered silicon and stacking faults are basic defects in near-surface layers of oxidated
 monocrystalline silicon. It was shown that stacking faults are generated during the
 oxidation process, and the mechanism of their formation is connected with the defective
 layered structure of initial silicon wafers. It was established that defects of layered
 heterogeneity, on the one hand, lead to the formation of stacking faults and, on the other
 hand, prevent their propagation to the wafer bulk.
ISSN:1560-8034