Genesis of initial defects in the process of monocrystalline silicon oxidation with subsequent scribing

The type, density, and distribution of defects in initial and oxidated monocrystalline silicon wafers were studied by modern methods. It was established that disordered silicon and stacking faults are basic defects in near-surface layers of oxidated monocrystalline silicon. It was shown that stac...

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Published in:Semiconductor Physics Quantum Electronics & Optoelectronics
Date:2010
Main Authors: Smyntyna, V.A., Sviridova, O.V.
Format: Article
Language:English
Published: Інститут фізики напівпровідників імені В.Є. Лашкарьова НАН України 2010
Online Access:https://nasplib.isofts.kiev.ua/handle/123456789/117746
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Journal Title:Digital Library of Periodicals of National Academy of Sciences of Ukraine
Cite this:Genesis of initial defects in the process of monocrystalline silicon oxidation with subsequent scribing/ V.A. Smyntyna and O.V. Sviridova // Semiconductor Physics Quantum Electronics & Optoelectronics. — 2010. — Т. 13, № 1. — С. 74-78. — Бібліогр.: 17 назв. — англ.

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Digital Library of Periodicals of National Academy of Sciences of Ukraine
id nasplib_isofts_kiev_ua-123456789-117746
record_format dspace
spelling Smyntyna, V.A.
Sviridova, O.V.
2017-05-26T15:40:24Z
2017-05-26T15:40:24Z
2010
Genesis of initial defects in the process of monocrystalline silicon oxidation with subsequent scribing/ V.A. Smyntyna and O.V. Sviridova // Semiconductor Physics Quantum Electronics & Optoelectronics. — 2010. — Т. 13, № 1. — С. 74-78. — Бібліогр.: 17 назв. — англ.
1560-8034
PACS 61.72.Nn
https://nasplib.isofts.kiev.ua/handle/123456789/117746
The type, density, and distribution of defects in initial and oxidated monocrystalline silicon wafers were studied by modern methods. It was established that disordered silicon and stacking faults are basic defects in near-surface layers of oxidated monocrystalline silicon. It was shown that stacking faults are generated during the oxidation process, and the mechanism of their formation is connected with the defective layered structure of initial silicon wafers. It was established that defects of layered heterogeneity, on the one hand, lead to the formation of stacking faults and, on the other hand, prevent their propagation to the wafer bulk.
en
Інститут фізики напівпровідників імені В.Є. Лашкарьова НАН України
Semiconductor Physics Quantum Electronics & Optoelectronics
Genesis of initial defects in the process of monocrystalline silicon oxidation with subsequent scribing
Article
published earlier
institution Digital Library of Periodicals of National Academy of Sciences of Ukraine
collection DSpace DC
title Genesis of initial defects in the process of monocrystalline silicon oxidation with subsequent scribing
spellingShingle Genesis of initial defects in the process of monocrystalline silicon oxidation with subsequent scribing
Smyntyna, V.A.
Sviridova, O.V.
title_short Genesis of initial defects in the process of monocrystalline silicon oxidation with subsequent scribing
title_full Genesis of initial defects in the process of monocrystalline silicon oxidation with subsequent scribing
title_fullStr Genesis of initial defects in the process of monocrystalline silicon oxidation with subsequent scribing
title_full_unstemmed Genesis of initial defects in the process of monocrystalline silicon oxidation with subsequent scribing
title_sort genesis of initial defects in the process of monocrystalline silicon oxidation with subsequent scribing
author Smyntyna, V.A.
Sviridova, O.V.
author_facet Smyntyna, V.A.
Sviridova, O.V.
publishDate 2010
language English
container_title Semiconductor Physics Quantum Electronics & Optoelectronics
publisher Інститут фізики напівпровідників імені В.Є. Лашкарьова НАН України
format Article
description The type, density, and distribution of defects in initial and oxidated monocrystalline silicon wafers were studied by modern methods. It was established that disordered silicon and stacking faults are basic defects in near-surface layers of oxidated monocrystalline silicon. It was shown that stacking faults are generated during the oxidation process, and the mechanism of their formation is connected with the defective layered structure of initial silicon wafers. It was established that defects of layered heterogeneity, on the one hand, lead to the formation of stacking faults and, on the other hand, prevent their propagation to the wafer bulk.
issn 1560-8034
url https://nasplib.isofts.kiev.ua/handle/123456789/117746
citation_txt Genesis of initial defects in the process of monocrystalline silicon oxidation with subsequent scribing/ V.A. Smyntyna and O.V. Sviridova // Semiconductor Physics Quantum Electronics & Optoelectronics. — 2010. — Т. 13, № 1. — С. 74-78. — Бібліогр.: 17 назв. — англ.
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first_indexed 2025-12-07T16:17:53Z
last_indexed 2025-12-07T16:17:53Z
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