Heat-resistant ohmic and barrier contacts for GaAs-based microwave devices

We studied barrier and ohmic contacts that are used when developing GaAs-based microwave devices. It is shown that Au-Mo-TiBx-n-GaAs barrier contacts have higher thermal stability than Au-Ti-n-GaAs ones. This is due to substantial slowdown of grain-boundary diffusion in Au-Mo-TiBx contacts resulting...

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Published in:Semiconductor Physics Quantum Electronics & Optoelectronics
Date:2003
Main Authors: Ivanov, V.N., Konakova, R.V., Milenin, V.V., Stovpovoi, M.A.
Format: Article
Language:English
Published: Інститут фізики напівпровідників імені В.Є. Лашкарьова НАН України 2003
Online Access:https://nasplib.isofts.kiev.ua/handle/123456789/118027
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Journal Title:Digital Library of Periodicals of National Academy of Sciences of Ukraine
Cite this:Heat-resistant ohmic and barrier contacts for GaAs-based microwave devices / V.N. Ivanov, R.V. Konakova, V.V. Milenin, M.A. Stovpovoi // Semiconductor Physics Quantum Electronics & Optoelectronics. — 2003. — Т. 6, № 3. — С. 311-315. — Бібліогр.: 7 назв. — англ.

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Digital Library of Periodicals of National Academy of Sciences of Ukraine
id nasplib_isofts_kiev_ua-123456789-118027
record_format dspace
spelling Ivanov, V.N.
Konakova, R.V.
Milenin, V.V.
Stovpovoi, M.A.
2017-05-28T08:41:00Z
2017-05-28T08:41:00Z
2003
Heat-resistant ohmic and barrier contacts for GaAs-based microwave devices / V.N. Ivanov, R.V. Konakova, V.V. Milenin, M.A. Stovpovoi // Semiconductor Physics Quantum Electronics & Optoelectronics. — 2003. — Т. 6, № 3. — С. 311-315. — Бібліогр.: 7 назв. — англ.
1560-8034
PACS: 85.30.Fg
https://nasplib.isofts.kiev.ua/handle/123456789/118027
We studied barrier and ohmic contacts that are used when developing GaAs-based microwave devices. It is shown that Au-Mo-TiBx-n-GaAs barrier contacts have higher thermal stability than Au-Ti-n-GaAs ones. This is due to substantial slowdown of grain-boundary diffusion in Au-Mo-TiBx contacts resulting from use of amorphous TiBx layers as barrier material. A phase transition in them occurs at a temperature over 1000 °С. It was determined that use of TiBx as an antidiffusion layer in Au-TiBx-AuGe-n-GaAs ohmic contacts to Gunn diodes increases their service life as compared to the traditional Au-AuGe-n-GaAs ohmic contact.
en
Інститут фізики напівпровідників імені В.Є. Лашкарьова НАН України
Semiconductor Physics Quantum Electronics & Optoelectronics
Heat-resistant ohmic and barrier contacts for GaAs-based microwave devices
Article
published earlier
institution Digital Library of Periodicals of National Academy of Sciences of Ukraine
collection DSpace DC
title Heat-resistant ohmic and barrier contacts for GaAs-based microwave devices
spellingShingle Heat-resistant ohmic and barrier contacts for GaAs-based microwave devices
Ivanov, V.N.
Konakova, R.V.
Milenin, V.V.
Stovpovoi, M.A.
title_short Heat-resistant ohmic and barrier contacts for GaAs-based microwave devices
title_full Heat-resistant ohmic and barrier contacts for GaAs-based microwave devices
title_fullStr Heat-resistant ohmic and barrier contacts for GaAs-based microwave devices
title_full_unstemmed Heat-resistant ohmic and barrier contacts for GaAs-based microwave devices
title_sort heat-resistant ohmic and barrier contacts for gaas-based microwave devices
author Ivanov, V.N.
Konakova, R.V.
Milenin, V.V.
Stovpovoi, M.A.
author_facet Ivanov, V.N.
Konakova, R.V.
Milenin, V.V.
Stovpovoi, M.A.
publishDate 2003
language English
container_title Semiconductor Physics Quantum Electronics & Optoelectronics
publisher Інститут фізики напівпровідників імені В.Є. Лашкарьова НАН України
format Article
description We studied barrier and ohmic contacts that are used when developing GaAs-based microwave devices. It is shown that Au-Mo-TiBx-n-GaAs barrier contacts have higher thermal stability than Au-Ti-n-GaAs ones. This is due to substantial slowdown of grain-boundary diffusion in Au-Mo-TiBx contacts resulting from use of amorphous TiBx layers as barrier material. A phase transition in them occurs at a temperature over 1000 °С. It was determined that use of TiBx as an antidiffusion layer in Au-TiBx-AuGe-n-GaAs ohmic contacts to Gunn diodes increases their service life as compared to the traditional Au-AuGe-n-GaAs ohmic contact.
issn 1560-8034
url https://nasplib.isofts.kiev.ua/handle/123456789/118027
citation_txt Heat-resistant ohmic and barrier contacts for GaAs-based microwave devices / V.N. Ivanov, R.V. Konakova, V.V. Milenin, M.A. Stovpovoi // Semiconductor Physics Quantum Electronics & Optoelectronics. — 2003. — Т. 6, № 3. — С. 311-315. — Бібліогр.: 7 назв. — англ.
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AT stovpovoima heatresistantohmicandbarriercontactsforgaasbasedmicrowavedevices
first_indexed 2025-12-07T17:09:56Z
last_indexed 2025-12-07T17:09:56Z
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