Hydrogen gettering in annealed oxygen-implanted silicon

Hydrogen gettering by buried layers formed in oxygen-implanted silicon (Si:O
 prepared by O²⁺ implantation at the energy 200 keV and doses 10¹⁴ and 10¹⁷ cm⁻²) was
 investigated after annealing of Si:O at temperatures up to 1570 K, including also
 processing under enhanced...

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Veröffentlicht in:Semiconductor Physics Quantum Electronics & Optoelectronics
Datum:2010
Hauptverfasser: Misiuk, A., Barcz, A., Ulyashin, A., Antonova, I.V., Prujszczyk, M.
Format: Artikel
Sprache:Englisch
Veröffentlicht: Інститут фізики напівпровідників імені В.Є. Лашкарьова НАН України 2010
Online Zugang:https://nasplib.isofts.kiev.ua/handle/123456789/118217
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Zitieren:Hydrogen gettering in annealed oxygen-implanted silicon/ A. Misiuk, A. Barcz, A. Ulyashin, I.V. Antonova, M. Prujszczyk // Semiconductor Physics Quantum Electronics & Optoelectronics. — 2010. — Т. 13, № 2. — С. 161-165. — Бібліогр.: 9 назв. — англ.

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Digital Library of Periodicals of National Academy of Sciences of Ukraine
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author Misiuk, A.
Barcz, A.
Ulyashin, A.
Antonova, I.V.
Prujszczyk, M.
author_facet Misiuk, A.
Barcz, A.
Ulyashin, A.
Antonova, I.V.
Prujszczyk, M.
citation_txt Hydrogen gettering in annealed oxygen-implanted silicon/ A. Misiuk, A. Barcz, A. Ulyashin, I.V. Antonova, M. Prujszczyk // Semiconductor Physics Quantum Electronics & Optoelectronics. — 2010. — Т. 13, № 2. — С. 161-165. — Бібліогр.: 9 назв. — англ.
collection DSpace DC
container_title Semiconductor Physics Quantum Electronics & Optoelectronics
description Hydrogen gettering by buried layers formed in oxygen-implanted silicon (Si:O
 prepared by O²⁺ implantation at the energy 200 keV and doses 10¹⁴ and 10¹⁷ cm⁻²) was
 investigated after annealing of Si:O at temperatures up to 1570 K, including also
 processing under enhanced hydrostatic pressure, up to 1.2 GPa. Depending on processing
 conditions, buried layers containing SiO₂₋x clusters and/or precipitates were formed. To
 produce hydrogen-rich Si:O,H structures, Si:O samples were subsequently treated in RF
 hydrogen plasma. As determined using secondary ion mass spectrometry, hydrogen was
 accumulated in sub-surface region as well as within implantation-disturbed areas. It has
 been found that hydrogen was still present in Si:O,H structures formed by oxygen
 implantation with the dose D = 10⁷ cm⁻² even after post-implantation annealing up to
 873 K. It is concluded that hydrogen accumulation within the disturbed areas in Si:O as
 well as in SOI structures can be used for recognition of defects.
first_indexed 2025-12-07T19:33:10Z
format Article
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institution Digital Library of Periodicals of National Academy of Sciences of Ukraine
issn 1560-8034
language English
last_indexed 2025-12-07T19:33:10Z
publishDate 2010
publisher Інститут фізики напівпровідників імені В.Є. Лашкарьова НАН України
record_format dspace
spelling Misiuk, A.
Barcz, A.
Ulyashin, A.
Antonova, I.V.
Prujszczyk, M.
2017-05-29T12:56:29Z
2017-05-29T12:56:29Z
2010
Hydrogen gettering in annealed oxygen-implanted silicon/ A. Misiuk, A. Barcz, A. Ulyashin, I.V. Antonova, M. Prujszczyk // Semiconductor Physics Quantum Electronics & Optoelectronics. — 2010. — Т. 13, № 2. — С. 161-165. — Бібліогр.: 9 назв. — англ.
1560-8034
PACS 52.40.Hf, 61.05.C-, 68.37.Ps, 82.80.Ms
https://nasplib.isofts.kiev.ua/handle/123456789/118217
Hydrogen gettering by buried layers formed in oxygen-implanted silicon (Si:O
 prepared by O²⁺ implantation at the energy 200 keV and doses 10¹⁴ and 10¹⁷ cm⁻²) was
 investigated after annealing of Si:O at temperatures up to 1570 K, including also
 processing under enhanced hydrostatic pressure, up to 1.2 GPa. Depending on processing
 conditions, buried layers containing SiO₂₋x clusters and/or precipitates were formed. To
 produce hydrogen-rich Si:O,H structures, Si:O samples were subsequently treated in RF
 hydrogen plasma. As determined using secondary ion mass spectrometry, hydrogen was
 accumulated in sub-surface region as well as within implantation-disturbed areas. It has
 been found that hydrogen was still present in Si:O,H structures formed by oxygen
 implantation with the dose D = 10⁷ cm⁻² even after post-implantation annealing up to
 873 K. It is concluded that hydrogen accumulation within the disturbed areas in Si:O as
 well as in SOI structures can be used for recognition of defects.
en
Інститут фізики напівпровідників імені В.Є. Лашкарьова НАН України
Semiconductor Physics Quantum Electronics & Optoelectronics
Hydrogen gettering in annealed oxygen-implanted silicon
Article
published earlier
spellingShingle Hydrogen gettering in annealed oxygen-implanted silicon
Misiuk, A.
Barcz, A.
Ulyashin, A.
Antonova, I.V.
Prujszczyk, M.
title Hydrogen gettering in annealed oxygen-implanted silicon
title_full Hydrogen gettering in annealed oxygen-implanted silicon
title_fullStr Hydrogen gettering in annealed oxygen-implanted silicon
title_full_unstemmed Hydrogen gettering in annealed oxygen-implanted silicon
title_short Hydrogen gettering in annealed oxygen-implanted silicon
title_sort hydrogen gettering in annealed oxygen-implanted silicon
url https://nasplib.isofts.kiev.ua/handle/123456789/118217
work_keys_str_mv AT misiuka hydrogengetteringinannealedoxygenimplantedsilicon
AT barcza hydrogengetteringinannealedoxygenimplantedsilicon
AT ulyashina hydrogengetteringinannealedoxygenimplantedsilicon
AT antonovaiv hydrogengetteringinannealedoxygenimplantedsilicon
AT prujszczykm hydrogengetteringinannealedoxygenimplantedsilicon