Influence of initial defects on defect formation process in ion doped silicon

We study the influence of initial defects in high-resistance epitaxial silicon
 layers of high-resistance epitaxial silicon structures on defect formation processes at ion
 boron doping. The method of reverse voltage-capacitance characteristics revealed two
 maxima of dopant...

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Published in:Semiconductor Physics Quantum Electronics & Optoelectronics
Date:2009
Main Authors: Smyntyna, V.A., Sviridova, O.V.
Format: Article
Language:English
Published: Інститут фізики напівпровідників імені В.Є. Лашкарьова НАН України 2009
Online Access:https://nasplib.isofts.kiev.ua/handle/123456789/118682
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Journal Title:Digital Library of Periodicals of National Academy of Sciences of Ukraine
Cite this:Influence of initial defects on defect formation process
 in ion doped silicon / V.A. Smyntyna, O.V. Sviridova // Semiconductor Physics Quantum Electronics & Optoelectronics. — 2009. — Т. 12, № 2. — С. 110-115. — Бібліогр.: 19 назв. — англ.

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Digital Library of Periodicals of National Academy of Sciences of Ukraine
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author Smyntyna, V.A.
Sviridova, O.V.
author_facet Smyntyna, V.A.
Sviridova, O.V.
citation_txt Influence of initial defects on defect formation process
 in ion doped silicon / V.A. Smyntyna, O.V. Sviridova // Semiconductor Physics Quantum Electronics & Optoelectronics. — 2009. — Т. 12, № 2. — С. 110-115. — Бібліогр.: 19 назв. — англ.
collection DSpace DC
container_title Semiconductor Physics Quantum Electronics & Optoelectronics
description We study the influence of initial defects in high-resistance epitaxial silicon
 layers of high-resistance epitaxial silicon structures on defect formation processes at ion
 boron doping. The method of reverse voltage-capacitance characteristics revealed two
 maxima of dopant concentration in epitaxial silicon layers ion-doped by boron. Studing
 the structure of the near-surface area in ion-doped epitaxial silicon by means of modern
 methods has shown that in the field of the first concentration maximum (the nearest one
 to a wafer surface), the fine-blocked silicon structure is localised. In the range of the
 second doping concentration maximum, the grid of dislocations with the variable period
 within one grid and consisting of 60° dislocations is found out. In the area of dislocation
 grids, oxygen atoms have been found out. The variable period in the grid is related with a
 change of mechanical stress and deformation distribution law in the plane of dopant
 diffusion front as dependent on the presence of initial defects in silicon.
first_indexed 2025-12-07T13:09:59Z
format Article
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id nasplib_isofts_kiev_ua-123456789-118682
institution Digital Library of Periodicals of National Academy of Sciences of Ukraine
issn 1560-8034
language English
last_indexed 2025-12-07T13:09:59Z
publishDate 2009
publisher Інститут фізики напівпровідників імені В.Є. Лашкарьова НАН України
record_format dspace
spelling Smyntyna, V.A.
Sviridova, O.V.
2017-05-30T19:38:07Z
2017-05-30T19:38:07Z
2009
Influence of initial defects on defect formation process
 in ion doped silicon / V.A. Smyntyna, O.V. Sviridova // Semiconductor Physics Quantum Electronics & Optoelectronics. — 2009. — Т. 12, № 2. — С. 110-115. — Бібліогр.: 19 назв. — англ.
1560-8034
PACS 61.72, 73.20.Hb
https://nasplib.isofts.kiev.ua/handle/123456789/118682
We study the influence of initial defects in high-resistance epitaxial silicon
 layers of high-resistance epitaxial silicon structures on defect formation processes at ion
 boron doping. The method of reverse voltage-capacitance characteristics revealed two
 maxima of dopant concentration in epitaxial silicon layers ion-doped by boron. Studing
 the structure of the near-surface area in ion-doped epitaxial silicon by means of modern
 methods has shown that in the field of the first concentration maximum (the nearest one
 to a wafer surface), the fine-blocked silicon structure is localised. In the range of the
 second doping concentration maximum, the grid of dislocations with the variable period
 within one grid and consisting of 60° dislocations is found out. In the area of dislocation
 grids, oxygen atoms have been found out. The variable period in the grid is related with a
 change of mechanical stress and deformation distribution law in the plane of dopant
 diffusion front as dependent on the presence of initial defects in silicon.
en
Інститут фізики напівпровідників імені В.Є. Лашкарьова НАН України
Semiconductor Physics Quantum Electronics & Optoelectronics
Influence of initial defects on defect formation process in ion doped silicon
Article
published earlier
spellingShingle Influence of initial defects on defect formation process in ion doped silicon
Smyntyna, V.A.
Sviridova, O.V.
title Influence of initial defects on defect formation process in ion doped silicon
title_full Influence of initial defects on defect formation process in ion doped silicon
title_fullStr Influence of initial defects on defect formation process in ion doped silicon
title_full_unstemmed Influence of initial defects on defect formation process in ion doped silicon
title_short Influence of initial defects on defect formation process in ion doped silicon
title_sort influence of initial defects on defect formation process in ion doped silicon
url https://nasplib.isofts.kiev.ua/handle/123456789/118682
work_keys_str_mv AT smyntynava influenceofinitialdefectsondefectformationprocessiniondopedsilicon
AT sviridovaov influenceofinitialdefectsondefectformationprocessiniondopedsilicon