Properties of SiGe/Si heterostructures fabricated by ion implantation technique

A comprehensive electrical characterisation of the SiGe/Si heterostructures has been performed in the wide temperature range (10270 K). Four structures fabricated by the Ge⁺ ion implantation technique at different substrate temperatures (room temperature, 150°C, 450°C and 600°C) have been studied. T...

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Published in:Semiconductor Physics Quantum Electronics & Optoelectronics
Date:1999
Main Authors: Gomeniuk, Y.V., Lysenko, V.S., Osiyuk, I.N., Tyagulski, I.P., Valakh, M.Ya., Yukhimchuk, V.A., Willander, M., Patel, C.J.
Format: Article
Language:English
Published: Інститут фізики напівпровідників імені В.Є. Лашкарьова НАН України 1999
Online Access:https://nasplib.isofts.kiev.ua/handle/123456789/119871
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Journal Title:Digital Library of Periodicals of National Academy of Sciences of Ukraine
Cite this:Properties of SiGe/Si heterostructures fabricated by ion implantation technique / Y.V. Gomeniuk, V.S. Lysenko, I.N. Osiyuk, I.P. Tyagulski, M.Ya. Valakh, V.A. Yukhimchuk, M. Willander, C.J. Patel // Semiconductor Physics Quantum Electronics & Optoelectronics. — 1999. — Т. 2, № 3. — С. 74-80. — Бібліогр.: 16 назв. — англ.

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Digital Library of Periodicals of National Academy of Sciences of Ukraine
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author Gomeniuk, Y.V.
Lysenko, V.S.
Osiyuk, I.N.
Tyagulski, I.P.
Valakh, M.Ya.
Yukhimchuk, V.A.
Willander, M.
Patel, C.J.
author_facet Gomeniuk, Y.V.
Lysenko, V.S.
Osiyuk, I.N.
Tyagulski, I.P.
Valakh, M.Ya.
Yukhimchuk, V.A.
Willander, M.
Patel, C.J.
citation_txt Properties of SiGe/Si heterostructures fabricated by ion implantation technique / Y.V. Gomeniuk, V.S. Lysenko, I.N. Osiyuk, I.P. Tyagulski, M.Ya. Valakh, V.A. Yukhimchuk, M. Willander, C.J. Patel // Semiconductor Physics Quantum Electronics & Optoelectronics. — 1999. — Т. 2, № 3. — С. 74-80. — Бібліогр.: 16 назв. — англ.
collection DSpace DC
container_title Semiconductor Physics Quantum Electronics & Optoelectronics
description A comprehensive electrical characterisation of the SiGe/Si heterostructures has been performed in the wide temperature range (10270 K). Four structures fabricated by the Ge⁺ ion implantation technique at different substrate temperatures (room temperature, 150°C, 450°C and 600°C) have been studied. The diode I-V characteristics, thermally stimulated capacitance and currents were measured and the presence and parameters of shallow trap levels were determined in dependence on the substrate temperature. The sample implanted at 450°C shows the best diode operation reflecting the higher quality of the surface silicon layer as compared to RT- and 150°C-implanted samples. Implantation-induced mechanical stresses have been investigated by Raman spectroscopy. For the first time the cryogenic TSCR technique has been applied to this system which makes it possible to investigate strain in the silicon layer due to SiGe layer formation.
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last_indexed 2025-12-07T18:36:34Z
publishDate 1999
publisher Інститут фізики напівпровідників імені В.Є. Лашкарьова НАН України
record_format dspace
spelling Gomeniuk, Y.V.
Lysenko, V.S.
Osiyuk, I.N.
Tyagulski, I.P.
Valakh, M.Ya.
Yukhimchuk, V.A.
Willander, M.
Patel, C.J.
2017-06-10T08:05:19Z
2017-06-10T08:05:19Z
1999
Properties of SiGe/Si heterostructures fabricated by ion implantation technique / Y.V. Gomeniuk, V.S. Lysenko, I.N. Osiyuk, I.P. Tyagulski, M.Ya. Valakh, V.A. Yukhimchuk, M. Willander, C.J. Patel // Semiconductor Physics Quantum Electronics & Optoelectronics. — 1999. — Т. 2, № 3. — С. 74-80. — Бібліогр.: 16 назв. — англ.
1560-8034
PACS: 73.20.Hb; 73.40.Lq; 78.30.-j
https://nasplib.isofts.kiev.ua/handle/123456789/119871
A comprehensive electrical characterisation of the SiGe/Si heterostructures has been performed in the wide temperature range (10270 K). Four structures fabricated by the Ge⁺ ion implantation technique at different substrate temperatures (room temperature, 150°C, 450°C and 600°C) have been studied. The diode I-V characteristics, thermally stimulated capacitance and currents were measured and the presence and parameters of shallow trap levels were determined in dependence on the substrate temperature. The sample implanted at 450°C shows the best diode operation reflecting the higher quality of the surface silicon layer as compared to RT- and 150°C-implanted samples. Implantation-induced mechanical stresses have been investigated by Raman spectroscopy. For the first time the cryogenic TSCR technique has been applied to this system which makes it possible to investigate strain in the silicon layer due to SiGe layer formation.
en
Інститут фізики напівпровідників імені В.Є. Лашкарьова НАН України
Semiconductor Physics Quantum Electronics & Optoelectronics
Properties of SiGe/Si heterostructures fabricated by ion implantation technique
Article
published earlier
spellingShingle Properties of SiGe/Si heterostructures fabricated by ion implantation technique
Gomeniuk, Y.V.
Lysenko, V.S.
Osiyuk, I.N.
Tyagulski, I.P.
Valakh, M.Ya.
Yukhimchuk, V.A.
Willander, M.
Patel, C.J.
title Properties of SiGe/Si heterostructures fabricated by ion implantation technique
title_full Properties of SiGe/Si heterostructures fabricated by ion implantation technique
title_fullStr Properties of SiGe/Si heterostructures fabricated by ion implantation technique
title_full_unstemmed Properties of SiGe/Si heterostructures fabricated by ion implantation technique
title_short Properties of SiGe/Si heterostructures fabricated by ion implantation technique
title_sort properties of sige/si heterostructures fabricated by ion implantation technique
url https://nasplib.isofts.kiev.ua/handle/123456789/119871
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AT lysenkovs propertiesofsigesiheterostructuresfabricatedbyionimplantationtechnique
AT osiyukin propertiesofsigesiheterostructuresfabricatedbyionimplantationtechnique
AT tyagulskiip propertiesofsigesiheterostructuresfabricatedbyionimplantationtechnique
AT valakhmya propertiesofsigesiheterostructuresfabricatedbyionimplantationtechnique
AT yukhimchukva propertiesofsigesiheterostructuresfabricatedbyionimplantationtechnique
AT willanderm propertiesofsigesiheterostructuresfabricatedbyionimplantationtechnique
AT patelcj propertiesofsigesiheterostructuresfabricatedbyionimplantationtechnique