Characterization of MOS structure using low-k dielectric methylsilsesquioxane with evaporated and sputtered aluminium gate

The organic methylsilsesquioxane (MSQ) demonstrates low dielectric constant value (2.6) and is promising interlayer dielectric material to reduce the capacitive coupling between metal layers in semiconductor integrated circuits. However, MSQ has lower film density and therefore is more porous than t...

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Опубліковано в: :Semiconductor Physics Quantum Electronics & Optoelectronics
Дата:2002
Автори: Aw, K.C., Ibrahim, K.
Формат: Стаття
Мова:Англійська
Опубліковано: Інститут фізики напівпровідників імені В.Є. Лашкарьова НАН України 2002
Онлайн доступ:https://nasplib.isofts.kiev.ua/handle/123456789/121295
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Назва журналу:Digital Library of Periodicals of National Academy of Sciences of Ukraine
Цитувати:Characterization of MOS structure using low-k dielectric methylsilsesquioxane with evaporated and sputtered aluminium gate / K.C. Aw, K. Ibrahim // Semiconductor Physics Quantum Electronics & Optoelectronics. — 2002. — Т. 5, № 3. — С. 316-318. — Бібліогр.: 5 назв. — англ.

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Digital Library of Periodicals of National Academy of Sciences of Ukraine
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author Aw, K.C.
Ibrahim, K.
author_facet Aw, K.C.
Ibrahim, K.
citation_txt Characterization of MOS structure using low-k dielectric methylsilsesquioxane with evaporated and sputtered aluminium gate / K.C. Aw, K. Ibrahim // Semiconductor Physics Quantum Electronics & Optoelectronics. — 2002. — Т. 5, № 3. — С. 316-318. — Бібліогр.: 5 назв. — англ.
collection DSpace DC
container_title Semiconductor Physics Quantum Electronics & Optoelectronics
description The organic methylsilsesquioxane (MSQ) demonstrates low dielectric constant value (2.6) and is promising interlayer dielectric material to reduce the capacitive coupling between metal layers in semiconductor integrated circuits. However, MSQ has lower film density and therefore is more porous than the traditional SiO2 film and could pose reliability issues. This paper is aimed to characterize the MOS capacitor (MOSC) structure with evaporated and sputtered aluminium method deposited on top of spin-on MSQ. Electrical characterization using C-V and I-t measurements during bias temperature stress (BTS) were used to understand the effect of evaporated and sputtered Al on MSQ. The results show that MOSC with evaporated aluminium has lower breakdown voltage and has poor reliability as compared to structures with sputtered aluminium. The high temperature required for evaporation compared to sputtering process caused these, which cause defects at the aluminium/MSQ interface. Sputtered aluminium gate structures demonstrate Al+ injection under high positive voltage stress due to ionization at the Al/MSQ interface.
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language English
last_indexed 2025-12-07T20:26:08Z
publishDate 2002
publisher Інститут фізики напівпровідників імені В.Є. Лашкарьова НАН України
record_format dspace
spelling Aw, K.C.
Ibrahim, K.
2017-06-13T20:37:26Z
2017-06-13T20:37:26Z
2002
Characterization of MOS structure using low-k dielectric methylsilsesquioxane with evaporated and sputtered aluminium gate / K.C. Aw, K. Ibrahim // Semiconductor Physics Quantum Electronics & Optoelectronics. — 2002. — Т. 5, № 3. — С. 316-318. — Бібліогр.: 5 назв. — англ.
1560-8034
PACS: 43.70.Q
https://nasplib.isofts.kiev.ua/handle/123456789/121295
The organic methylsilsesquioxane (MSQ) demonstrates low dielectric constant value (2.6) and is promising interlayer dielectric material to reduce the capacitive coupling between metal layers in semiconductor integrated circuits. However, MSQ has lower film density and therefore is more porous than the traditional SiO2 film and could pose reliability issues. This paper is aimed to characterize the MOS capacitor (MOSC) structure with evaporated and sputtered aluminium method deposited on top of spin-on MSQ. Electrical characterization using C-V and I-t measurements during bias temperature stress (BTS) were used to understand the effect of evaporated and sputtered Al on MSQ. The results show that MOSC with evaporated aluminium has lower breakdown voltage and has poor reliability as compared to structures with sputtered aluminium. The high temperature required for evaporation compared to sputtering process caused these, which cause defects at the aluminium/MSQ interface. Sputtered aluminium gate structures demonstrate Al+ injection under high positive voltage stress due to ionization at the Al/MSQ interface.
The authors would like to thank Dr. Mat Johar and Miss Еe Вee Choo of University Science Malaysia for their help with the CV-meter measurement and clean-room support, respectively. The authors would also like to thank Altera Corporation, Penang 
 for the use of microprobing, НP Semiconductor Parameter Analyser, and Chemical Lab facility.
en
Інститут фізики напівпровідників імені В.Є. Лашкарьова НАН України
Semiconductor Physics Quantum Electronics & Optoelectronics
Characterization of MOS structure using low-k dielectric methylsilsesquioxane with evaporated and sputtered aluminium gate
Article
published earlier
spellingShingle Characterization of MOS structure using low-k dielectric methylsilsesquioxane with evaporated and sputtered aluminium gate
Aw, K.C.
Ibrahim, K.
title Characterization of MOS structure using low-k dielectric methylsilsesquioxane with evaporated and sputtered aluminium gate
title_full Characterization of MOS structure using low-k dielectric methylsilsesquioxane with evaporated and sputtered aluminium gate
title_fullStr Characterization of MOS structure using low-k dielectric methylsilsesquioxane with evaporated and sputtered aluminium gate
title_full_unstemmed Characterization of MOS structure using low-k dielectric methylsilsesquioxane with evaporated and sputtered aluminium gate
title_short Characterization of MOS structure using low-k dielectric methylsilsesquioxane with evaporated and sputtered aluminium gate
title_sort characterization of mos structure using low-k dielectric methylsilsesquioxane with evaporated and sputtered aluminium gate
url https://nasplib.isofts.kiev.ua/handle/123456789/121295
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AT ibrahimk characterizationofmosstructureusinglowkdielectricmethylsilsesquioxanewithevaporatedandsputteredaluminiumgate