Balance model for contactless chemo-mechanical polishing of wafers

• Published in: Semiconductor Physics Quantum Electronics & Optoelectronics
• Date: 2002
• Main Authors: Grigoriev, N.N., Kravetsky, M.Yu., Paschenko, G.A., Sypko, S.A., Fomin, A.V.
• Format: Article
• Language: English
• Published: Інститут фізики напівпровідників імені В.Є. Лашкарьова НАН України 2002
• Online Access: https://nasplib.isofts.kiev.ua/handle/123456789/121333
• Journal Title: Digital Library of Periodicals of National Academy of Sciences of Ukraine
• Cite this: Balance model for contactless chemo-mechanical polishing of wafers / N.N. Grigoriev, M.Yu. Kravetsky, G.A. Paschenko, S.A. Sypko, A.V. Fomin // Semiconductor Physics Quantum Electronics & Optoelectronics. — 2002. — Т. 5, № 3. — С. 332-336. — Бібліогр.: 8 назв. — англ.

We developed a physical model for polishing. It makes it possible to determine physico-chemical processes occurring at contactless chemo-mechanical polishing (CMP) of crystal surfaces. A balance equation for diffusion, convection and chemical flows is used to describe processes that are proceeding i...