Stamp stress analysis with low temperature nanoimprint lithography
High temperature nanoimprint lithography has the drawback of long process cycle, demoulding difficulty, polymer degradation, thermal stress. Low temperature nanoimprint lithography (LTNIL) can avoid these problems. LTNIL is also ideal for manufacturing biological compatibility samples since the samp...
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| Published in: | Functional Materials |
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| Date: | 2016 |
| Main Authors: | , , |
| Format: | Article |
| Language: | English |
| Published: |
НТК «Інститут монокристалів» НАН України
2016
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| Online Access: | https://nasplib.isofts.kiev.ua/handle/123456789/121489 |
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| Journal Title: | Digital Library of Periodicals of National Academy of Sciences of Ukraine |
| Cite this: | Stamp stress analysis with low temperature nanoimprint lithography / Hongwen Sun, Xiaochao Ma, Chenhui Hu // Functional Materials. — 2016. — Т. 23, № 3. — С. 517-520. — Бібліогр.: 11 назв. — англ. |
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Digital Library of Periodicals of National Academy of Sciences of Ukraine| _version_ | 1862552751201845248 |
|---|---|
| author | Hongwen Sun Xiaochao Ma Chenhui Hu |
| author_facet | Hongwen Sun Xiaochao Ma Chenhui Hu |
| citation_txt | Stamp stress analysis with low temperature nanoimprint lithography / Hongwen Sun, Xiaochao Ma, Chenhui Hu // Functional Materials. — 2016. — Т. 23, № 3. — С. 517-520. — Бібліогр.: 11 назв. — англ. |
| collection | DSpace DC |
| container_title | Functional Materials |
| description | High temperature nanoimprint lithography has the drawback of long process cycle, demoulding difficulty, polymer degradation, thermal stress. Low temperature nanoimprint lithography (LTNIL) can avoid these problems. LTNIL is also ideal for manufacturing biological compatibility samples since the samples do not sustain high temperature. However, LTNIL need to optimize the press parameters in order to fully transfer patterns. Finite Element Method (FEM) is an excellent approach to examine the filling process. The stamp stress was simulated from four points of view, imprint pressure, imprint temperature, stamp pattern and stamp material. It was found that the stress in the stamp corners is especially bigger than other areas, the stress increases with the stamps aspect ratio increases, and stress distribution is more uniform for dense pattern stamp.
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| first_indexed | 2025-11-25T21:02:32Z |
| format | Article |
| fulltext | |
| id | nasplib_isofts_kiev_ua-123456789-121489 |
| institution | Digital Library of Periodicals of National Academy of Sciences of Ukraine |
| issn | 1027-5495 |
| language | English |
| last_indexed | 2025-11-25T21:02:32Z |
| publishDate | 2016 |
| publisher | НТК «Інститут монокристалів» НАН України |
| record_format | dspace |
| spelling | Hongwen Sun Xiaochao Ma Chenhui Hu 2017-06-14T12:52:36Z 2017-06-14T12:52:36Z 2016 Stamp stress analysis with low temperature nanoimprint lithography / Hongwen Sun, Xiaochao Ma, Chenhui Hu // Functional Materials. — 2016. — Т. 23, № 3. — С. 517-520. — Бібліогр.: 11 назв. — англ. 1027-5495 DOI: dx.doi.org/10.15407/fm23.03.517 https://nasplib.isofts.kiev.ua/handle/123456789/121489 High temperature nanoimprint lithography has the drawback of long process cycle, demoulding difficulty, polymer degradation, thermal stress. Low temperature nanoimprint lithography (LTNIL) can avoid these problems. LTNIL is also ideal for manufacturing biological compatibility samples since the samples do not sustain high temperature. However, LTNIL need to optimize the press parameters in order to fully transfer patterns. Finite Element Method (FEM) is an excellent approach to examine the filling process. The stamp stress was simulated from four points of view, imprint pressure, imprint temperature, stamp pattern and stamp material. It was found that the stress in the stamp corners is especially bigger than other areas, the stress increases with the stamps aspect ratio increases, and stress distribution is more uniform for dense pattern stamp. en НТК «Інститут монокристалів» НАН України Functional Materials Technology Stamp stress analysis with low temperature nanoimprint lithography Article published earlier |
| spellingShingle | Stamp stress analysis with low temperature nanoimprint lithography Hongwen Sun Xiaochao Ma Chenhui Hu Technology |
| title | Stamp stress analysis with low temperature nanoimprint lithography |
| title_full | Stamp stress analysis with low temperature nanoimprint lithography |
| title_fullStr | Stamp stress analysis with low temperature nanoimprint lithography |
| title_full_unstemmed | Stamp stress analysis with low temperature nanoimprint lithography |
| title_short | Stamp stress analysis with low temperature nanoimprint lithography |
| title_sort | stamp stress analysis with low temperature nanoimprint lithography |
| topic | Technology |
| topic_facet | Technology |
| url | https://nasplib.isofts.kiev.ua/handle/123456789/121489 |
| work_keys_str_mv | AT hongwensun stampstressanalysiswithlowtemperaturenanoimprintlithography AT xiaochaoma stampstressanalysiswithlowtemperaturenanoimprintlithography AT chenhuihu stampstressanalysiswithlowtemperaturenanoimprintlithography |