Stamp stress analysis with low temperature nanoimprint lithography

• Published in: Functional Materials
• Date: 2016
• Main Authors: Hongwen Sun, Xiaochao Ma, Chenhui Hu
• Format: Article
• Language: English
• Published: НТК «Інститут монокристалів» НАН України 2016
• Subjects: Technology
• Online Access: https://nasplib.isofts.kiev.ua/handle/123456789/121489
• Journal Title: Digital Library of Periodicals of National Academy of Sciences of Ukraine
• Cite this: Stamp stress analysis with low temperature nanoimprint lithography / Hongwen Sun, Xiaochao Ma, Chenhui Hu // Functional Materials. — 2016. — Т. 23, № 3. — С. 517-520. — Бібліогр.: 11 назв. — англ.

High temperature nanoimprint lithography has the drawback of long process cycle, demoulding difficulty, polymer degradation, thermal stress. Low temperature nanoimprint lithography (LTNIL) can avoid these problems. LTNIL is also ideal for manufacturing biological compatibility samples since the samp...