Technology options for embedding low-profile electronic components in printed circuit boards

• Published in: Технология и конструирование в электронной аппаратуре
• Date: 2018
• Main Authors: Efimenko, A.A., Ryabov, V.O.
• Format: Article
• Language: English
• Published: Інститут фізики напівпровідників імені В.Є. Лашкарьова НАН України 2018
• Subjects: Современные электронные технологии
• Online Access: https://nasplib.isofts.kiev.ua/handle/123456789/133228
• Journal Title: Digital Library of Periodicals of National Academy of Sciences of Ukraine
• Cite this: Technology options for embedding low-profile electronic components in printed circuit boards / A.A. Efimenko, V.O. Ryabov // Технология и конструирование в электронной аппаратуре. — 2018. — № 1. — С. 3-12. — Бібліогр.: 13 назв. — англ.

In order to improve the overall characteristics of printed circuit boards, two technologies for the formation of multilayer printed circuit boards have been developed - with the embedding of low-profile electronic components in a layer of fiberglass and a monolithic layer of polyimide, provided that...