Technology options for embedding low-profile electronic components in printed circuit boards
In order to improve the overall characteristics of printed circuit boards, two technologies for the formation of multilayer printed circuit boards have been developed - with the embedding of low-profile electronic components in a layer of fiberglass and a monolithic layer of polyimide, provided that...
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| Published in: | Технология и конструирование в электронной аппаратуре |
|---|---|
| Date: | 2018 |
| Main Authors: | , |
| Format: | Article |
| Language: | English |
| Published: |
Інститут фізики напівпровідників імені В.Є. Лашкарьова НАН України
2018
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| Subjects: | |
| Online Access: | https://nasplib.isofts.kiev.ua/handle/123456789/133228 |
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| Journal Title: | Digital Library of Periodicals of National Academy of Sciences of Ukraine |
| Cite this: | Technology options for embedding low-profile electronic components in printed circuit boards / A.A. Efimenko, V.O. Ryabov // Технология и конструирование в электронной аппаратуре. — 2018. — № 1. — С. 3-12. — Бібліогр.: 13 назв. — англ. |