Investigation of residual stresses in sapphire plates after grinding and polishing
The method of flexure determination was used to investigate the dependence of residual stresses on the depth of damaged layer in sapphire plates with a diameter of 100 mm after grinding and polishing. The flexure was determined from nonflatness of the control side of the plate using an interferomete...
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| Published in: | Functional Materials |
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| Date: | 2012 |
| Main Authors: | , , , |
| Format: | Article |
| Language: | English |
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НТК «Інститут монокристалів» НАН України
2012
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| Online Access: | https://nasplib.isofts.kiev.ua/handle/123456789/135375 |
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| Journal Title: | Digital Library of Periodicals of National Academy of Sciences of Ukraine |
| Cite this: | Investigation of residual stresses in sapphire plates after grinding and polishing / A.T. Budnikov, E.A. Vovk, V.N. Kanishchev, S.I. Krivonogov // Functional Materials. — 2012. — Т. 19, № 4. — С. 478-482. — Бібліогр.: 14 назв. — англ. |
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Digital Library of Periodicals of National Academy of Sciences of Ukraine| _version_ | 1862739179885035520 |
|---|---|
| author | Budnikov, A.T. Vovk, E.A. Kanishchev, V.N. Krivonogov, S.I. |
| author_facet | Budnikov, A.T. Vovk, E.A. Kanishchev, V.N. Krivonogov, S.I. |
| citation_txt | Investigation of residual stresses in sapphire plates after grinding and polishing / A.T. Budnikov, E.A. Vovk, V.N. Kanishchev, S.I. Krivonogov // Functional Materials. — 2012. — Т. 19, № 4. — С. 478-482. — Бібліогр.: 14 назв. — англ. |
| collection | DSpace DC |
| container_title | Functional Materials |
| description | The method of flexure determination was used to investigate the dependence of residual stresses on the depth of damaged layer in sapphire plates with a diameter of 100 mm after grinding and polishing. The flexure was determined from nonflatness of the control side of the plate using an interferometer of IT-200 type. The layer damaged in the process of grinding or polishing (of the tested side of the plate) was removed by chemico-mechanical polish. The removed value was established to an accuracy of 0.1 mg by weighing the plate before and after the treatment. The plate flexure was found to diminish with each removed layer, and to disappear after removal of 7 µm and 0.4 µm thick layer of the ground and polished samples, respectively. The most essential deformation caused by residual stresses was observed in the layers of the ground and polished plates with a thickness of 0.12-0.24 µm and 0.09-0.14 µm, respectively.
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| first_indexed | 2025-12-07T20:08:03Z |
| format | Article |
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| id | nasplib_isofts_kiev_ua-123456789-135375 |
| institution | Digital Library of Periodicals of National Academy of Sciences of Ukraine |
| issn | 1027-5495 |
| language | English |
| last_indexed | 2025-12-07T20:08:03Z |
| publishDate | 2012 |
| publisher | НТК «Інститут монокристалів» НАН України |
| record_format | dspace |
| spelling | Budnikov, A.T. Vovk, E.A. Kanishchev, V.N. Krivonogov, S.I. 2018-06-15T06:05:30Z 2018-06-15T06:05:30Z 2012 Investigation of residual stresses in sapphire plates after grinding and polishing / A.T. Budnikov, E.A. Vovk, V.N. Kanishchev, S.I. Krivonogov // Functional Materials. — 2012. — Т. 19, № 4. — С. 478-482. — Бібліогр.: 14 назв. — англ. 1027-5495 https://nasplib.isofts.kiev.ua/handle/123456789/135375 The method of flexure determination was used to investigate the dependence of residual stresses on the depth of damaged layer in sapphire plates with a diameter of 100 mm after grinding and polishing. The flexure was determined from nonflatness of the control side of the plate using an interferometer of IT-200 type. The layer damaged in the process of grinding or polishing (of the tested side of the plate) was removed by chemico-mechanical polish. The removed value was established to an accuracy of 0.1 mg by weighing the plate before and after the treatment. The plate flexure was found to diminish with each removed layer, and to disappear after removal of 7 µm and 0.4 µm thick layer of the ground and polished samples, respectively. The most essential deformation caused by residual stresses was observed in the layers of the ground and polished plates with a thickness of 0.12-0.24 µm and 0.09-0.14 µm, respectively. en НТК «Інститут монокристалів» НАН України Functional Materials Characterization and properties Investigation of residual stresses in sapphire plates after grinding and polishing Дослідження залишкових напружень у пластинах сапфіру після їх шліфування та полірування Article published earlier |
| spellingShingle | Investigation of residual stresses in sapphire plates after grinding and polishing Budnikov, A.T. Vovk, E.A. Kanishchev, V.N. Krivonogov, S.I. Characterization and properties |
| title | Investigation of residual stresses in sapphire plates after grinding and polishing |
| title_alt | Дослідження залишкових напружень у пластинах сапфіру після їх шліфування та полірування |
| title_full | Investigation of residual stresses in sapphire plates after grinding and polishing |
| title_fullStr | Investigation of residual stresses in sapphire plates after grinding and polishing |
| title_full_unstemmed | Investigation of residual stresses in sapphire plates after grinding and polishing |
| title_short | Investigation of residual stresses in sapphire plates after grinding and polishing |
| title_sort | investigation of residual stresses in sapphire plates after grinding and polishing |
| topic | Characterization and properties |
| topic_facet | Characterization and properties |
| url | https://nasplib.isofts.kiev.ua/handle/123456789/135375 |
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