Investigation of residual stresses in sapphire plates after grinding and polishing

The method of flexure determination was used to investigate the dependence of residual stresses on the depth of damaged layer in sapphire plates with a diameter of 100 mm after grinding and polishing. The flexure was determined from nonflatness of the control side of the plate using an interferomete...

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Published in:Functional Materials
Date:2012
Main Authors: Budnikov, A.T., Vovk, E.A., Kanishchev, V.N., Krivonogov, S.I.
Format: Article
Language:English
Published: НТК «Інститут монокристалів» НАН України 2012
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Online Access:https://nasplib.isofts.kiev.ua/handle/123456789/135375
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Journal Title:Digital Library of Periodicals of National Academy of Sciences of Ukraine
Cite this:Investigation of residual stresses in sapphire plates after grinding and polishing / A.T. Budnikov, E.A. Vovk, V.N. Kanishchev, S.I. Krivonogov // Functional Materials. — 2012. — Т. 19, № 4. — С. 478-482. — Бібліогр.: 14 назв. — англ.

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Digital Library of Periodicals of National Academy of Sciences of Ukraine
id nasplib_isofts_kiev_ua-123456789-135375
record_format dspace
spelling Budnikov, A.T.
Vovk, E.A.
Kanishchev, V.N.
Krivonogov, S.I.
2018-06-15T06:05:30Z
2018-06-15T06:05:30Z
2012
Investigation of residual stresses in sapphire plates after grinding and polishing / A.T. Budnikov, E.A. Vovk, V.N. Kanishchev, S.I. Krivonogov // Functional Materials. — 2012. — Т. 19, № 4. — С. 478-482. — Бібліогр.: 14 назв. — англ.
1027-5495
https://nasplib.isofts.kiev.ua/handle/123456789/135375
The method of flexure determination was used to investigate the dependence of residual stresses on the depth of damaged layer in sapphire plates with a diameter of 100 mm after grinding and polishing. The flexure was determined from nonflatness of the control side of the plate using an interferometer of IT-200 type. The layer damaged in the process of grinding or polishing (of the tested side of the plate) was removed by chemico-mechanical polish. The removed value was established to an accuracy of 0.1 mg by weighing the plate before and after the treatment. The plate flexure was found to diminish with each removed layer, and to disappear after removal of 7 µm and 0.4 µm thick layer of the ground and polished samples, respectively. The most essential deformation caused by residual stresses was observed in the layers of the ground and polished plates with a thickness of 0.12-0.24 µm and 0.09-0.14 µm, respectively.
en
НТК «Інститут монокристалів» НАН України
Functional Materials
Characterization and properties
Investigation of residual stresses in sapphire plates after grinding and polishing
Дослідження залишкових напружень у пластинах сапфіру після їх шліфування та полірування
Article
published earlier
institution Digital Library of Periodicals of National Academy of Sciences of Ukraine
collection DSpace DC
title Investigation of residual stresses in sapphire plates after grinding and polishing
spellingShingle Investigation of residual stresses in sapphire plates after grinding and polishing
Budnikov, A.T.
Vovk, E.A.
Kanishchev, V.N.
Krivonogov, S.I.
Characterization and properties
title_short Investigation of residual stresses in sapphire plates after grinding and polishing
title_full Investigation of residual stresses in sapphire plates after grinding and polishing
title_fullStr Investigation of residual stresses in sapphire plates after grinding and polishing
title_full_unstemmed Investigation of residual stresses in sapphire plates after grinding and polishing
title_sort investigation of residual stresses in sapphire plates after grinding and polishing
author Budnikov, A.T.
Vovk, E.A.
Kanishchev, V.N.
Krivonogov, S.I.
author_facet Budnikov, A.T.
Vovk, E.A.
Kanishchev, V.N.
Krivonogov, S.I.
topic Characterization and properties
topic_facet Characterization and properties
publishDate 2012
language English
container_title Functional Materials
publisher НТК «Інститут монокристалів» НАН України
format Article
title_alt Дослідження залишкових напружень у пластинах сапфіру після їх шліфування та полірування
description The method of flexure determination was used to investigate the dependence of residual stresses on the depth of damaged layer in sapphire plates with a diameter of 100 mm after grinding and polishing. The flexure was determined from nonflatness of the control side of the plate using an interferometer of IT-200 type. The layer damaged in the process of grinding or polishing (of the tested side of the plate) was removed by chemico-mechanical polish. The removed value was established to an accuracy of 0.1 mg by weighing the plate before and after the treatment. The plate flexure was found to diminish with each removed layer, and to disappear after removal of 7 µm and 0.4 µm thick layer of the ground and polished samples, respectively. The most essential deformation caused by residual stresses was observed in the layers of the ground and polished plates with a thickness of 0.12-0.24 µm and 0.09-0.14 µm, respectively.
issn 1027-5495
url https://nasplib.isofts.kiev.ua/handle/123456789/135375
citation_txt Investigation of residual stresses in sapphire plates after grinding and polishing / A.T. Budnikov, E.A. Vovk, V.N. Kanishchev, S.I. Krivonogov // Functional Materials. — 2012. — Т. 19, № 4. — С. 478-482. — Бібліогр.: 14 назв. — англ.
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first_indexed 2025-12-07T20:08:03Z
last_indexed 2025-12-07T20:08:03Z
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