Comparison of blistering of W bulk and coatings under H₂, D₂ and He plasma irradiation

The surface topography of W bulk prepared by powder sintering (20 μm thickness) and W coatings deposited by cathodic arc evaporation and by argon ion sputtering was studied under the influence of low-energy hydrogen (deuterium) and helium plasma at room temperature. The surface modifications induc...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Datum:2018
Hauptverfasser: Nikitin, A.V., Kuprin, A.S., Tolstolutskaya, G.D., Vasilenko, R.L., Ovcharenko, V.D., Voyevodin, V.N.
Format: Artikel
Sprache:English
Veröffentlicht: Національний науковий центр «Харківський фізико-технічний інститут» НАН України 2018
Schriftenreihe:Вопросы атомной науки и техники
Schlagworte:
Online Zugang:https://nasplib.isofts.kiev.ua/handle/123456789/147033
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Назва журналу:Digital Library of Periodicals of National Academy of Sciences of Ukraine
Zitieren:Comparison of blistering of w bulk and coatings under H₂, D₂ and He plasma irradiation / A.V. Nikitin, A.S. Kuprin, G.D. Tolstolutskaya, R.L. Vasilenko, V.D. Ovcharenko, V.N. Voyevodin // Вопросы атомной науки и техники. — 2018. — № 2. — С. 29-34. — Бібліогр.: 17 назв. — англ.

Institution

Digital Library of Periodicals of National Academy of Sciences of Ukraine
Beschreibung
Zusammenfassung:The surface topography of W bulk prepared by powder sintering (20 μm thickness) and W coatings deposited by cathodic arc evaporation and by argon ion sputtering was studied under the influence of low-energy hydrogen (deuterium) and helium plasma at room temperature. The surface modifications induced by the plasma irradiation were studied by scanning electron microscopy. It was observed formation of blisters and sputtering. After helium and deuterium plasma irradiation, numerous blisters were observed on the surface of W foils samples and coatings deposited by argon ion sputtering. The surface of W coatings deposited by cathodic arc evaporation was undergone only sputtering process under the same irradiation conditions.