Thermodynamic and adhesive parameters of nanolayers in the system "metal-dielectric"

Evaluation technique of thermodynamic and adhesive parameters of interphase nanolayers in metal - insulator was developed by use of macroscopic methods of surface physics and thermodynamics methods of nonequilibrium processes. Typical parameters of interfacial interactions (interfacial energy, tensi...

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Збережено в:
Бібліографічні деталі
Опубліковано в: :Functional Materials
Дата:2018
Автори: Yuzevych, V.M., Koman, B.P., Dzhala, R.M.
Формат: Стаття
Мова:Англійська
Опубліковано: НТК «Інститут монокристалів» НАН України 2018
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Онлайн доступ:https://nasplib.isofts.kiev.ua/handle/123456789/157144
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Назва журналу:Digital Library of Periodicals of National Academy of Sciences of Ukraine
Цитувати:Thermodynamic and adhesive parameters of nanolayers in the system "metal-dielectric" / V.M. Yuzevych, B.P. Koman, R.M. Dzhala // Functional Materials. — 2018. — Т. 25, № 2. — С. 319-328. — Бібліогр.: 35 назв. — англ.

Репозитарії

Digital Library of Periodicals of National Academy of Sciences of Ukraine
Опис
Резюме:Evaluation technique of thermodynamic and adhesive parameters of interphase nanolayers in metal - insulator was developed by use of macroscopic methods of surface physics and thermodynamics methods of nonequilibrium processes. Typical parameters of interfacial interactions (interfacial energy, tension, density of electric charges, specific electrocapacity, electrical components of interfacial energy) for metals (Ag, Au, Cu, Fe) at Al₂O₃ interphase were calculated. It was found that increment of dielectric layer (Al₂O₃) surface tension which is accompanied with increasing of interfacial tensions and energies, electric component of the surface energy, specific surface charge of double electric layer and contact potential difference. The developed echnique can be used for evaluation of interfacial energy parameters of interaction between another physical nature composited pairs with aking into account the nature of the double electrical layer.
ISSN:1027-5495