Polymer composite materials with a high level of thermal stability based on phenolic resins and disperse silica fillers

• Date: 2018
• Main Authors: Kabat, O.S., Kobelchuk, Yu.M., Chervakov, D.O., Chervakov, O.V.
• Format: Article
• Language: English
• Published: Інститут досліджень науково-технічного потенціалу та історії науки ім. Г.М. Доброва НАН України 2018
• Series: Наука, технології, інновації
• Subjects: Інформаційні технології для виробництва
• Online Access: https://nasplib.isofts.kiev.ua/handle/123456789/162628
• Journal Title: Digital Library of Periodicals of National Academy of Sciences of Ukraine
• Cite this: Polymer composite materials with a high level of thermal stability based on phenolic resins and disperse silica fillers / O.S. Kabat, Yu.M. Kobelchuk, D.O. Chervakov, O.V. Chervakov // Наука, технології, інновації. — 2018. — № 2 (6). — С. 48-53. — Бібліогр.: 25 назв. — англ.

Development of the engineering industry is difficult without using of heat-resistant polymer composite materials for manufacturing of machines and mechanisms parts operating at temperatures up to 300°C. For this purpose it was suggested the diphenylolsulfone formaldehyde resin as a polymer matrix, and different modifications of disperse silicas — white soot WS-120 and aerosol A-380 — were selected for fillers. The developed phenoplasts have high level of thermal stability (up to 370 °C), it’s at 25–30°C is higher, then for initial resins. Apparently, this is a result of increasing of the interaction level on the boundary “polymer-disperse filler”, under the processing condition (at temperatures 170–190°C) due to appearing of covalent and hydrogen bonds between hydroxyl groups at the surface of the silica and methylol groups of the polymer matrix.