Fabrication and wear performance of (Cu–Sn) solution/TiCx bonded diamond composites

• Published in: Сверхтвердые материалы
• Date: 2018
• Main Authors: Baoyan, L., Danhui, H., Wangxi, Z.
• Format: Article
• Language: Russian
• Published: Інститут надтвердих матеріалів ім. В.М. Бакуля НАН України 2018
• Subjects: Получение, структура, свойства
• Online Access: https://nasplib.isofts.kiev.ua/handle/123456789/166989
• Journal Title: Digital Library of Periodicals of National Academy of Sciences of Ukraine
• Cite this: Fabrication and wear performance of (Cu–Sn) solution/TiCx bonded diamond composites / L. Baoyan, H. Danhui, Z. Wangxi // Сверхтвердые материалы. — 2018. — № 3. — С. 33-39. — Бібліогр.: 13 назв. — англ.

The Cu(Sn)–TiCx bonded diamond composites were prepared by in situ reaction sintering of Cu, Ti₂SnC and diamond powders. Effect of Ti₂SnC content on the phase composition, microstructure and grinding properties were studied. Вивчено вплив змісту Ti₂SnC на фазовий склад, мікроструктуру і шліфувальні...