Dynamic Stress Intensity Factor for Interfacial Cracks of Mode III Emanating from Circular Cavities in Piezoelectric Bimaterials
This paper investigates dynamic stress intensity factors in piezoelectric bimaterials with interfacial cracks emanating from the circular cavities under steady SH-waves. The interfacial cracks are assumed to be permeable. Green functions for the experiment were constructed through complex variable a...
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| Опубліковано в: : | Проблемы прочности |
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| Дата: | 2016 |
| Автори: | , , |
| Формат: | Стаття |
| Мова: | English |
| Опубліковано: |
Інститут проблем міцності ім. Г.С. Писаренко НАН України
2016
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| Онлайн доступ: | https://nasplib.isofts.kiev.ua/handle/123456789/173417 |
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| Назва журналу: | Digital Library of Periodicals of National Academy of Sciences of Ukraine |
| Цитувати: | Dynamic Stress Intensity Factor for Interfacial Cracks of Mode III Emanating from Circular Cavities in Piezoelectric Bimaterials / D. Li, H.C. Wang, L.X. Wu // Проблемы прочности. — 2016. — № 1. — С. 58-68. — Бібліогр.: 13 назв. — англ. |
Репозитарії
Digital Library of Periodicals of National Academy of Sciences of Ukraine| id |
nasplib_isofts_kiev_ua-123456789-173417 |
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Li, D. Wang, H.C. Wu, L.X. 2020-12-03T20:19:04Z 2020-12-03T20:19:04Z 2016 Dynamic Stress Intensity Factor for Interfacial Cracks of Mode III Emanating from Circular Cavities in Piezoelectric Bimaterials / D. Li, H.C. Wang, L.X. Wu // Проблемы прочности. — 2016. — № 1. — С. 58-68. — Бібліогр.: 13 назв. — англ. 0556-171X https://nasplib.isofts.kiev.ua/handle/123456789/173417 539.4 This paper investigates dynamic stress intensity factors in piezoelectric bimaterials with interfacial cracks emanating from the circular cavities under steady SH-waves. The interfacial cracks are assumed to be permeable. Green functions for the experiment were constructed through complex variable and wave function expansion methods. Based on the crack-division and conjunction techniques, a series of Fredholm integral equations of the first kind were established to calculate the stress intensity of the crack tips. Direct numerical integration was used to solve the equations. Some numerical results were plotted to indicate the influence of the defect geometry, material constants, and SH-wave frequencies on dynamic stress intensity factors. The authors are grateful for the support of the National Science Fund for Young Scholars of Hebei Education Department (Q2012031). en Інститут проблем міцності ім. Г.С. Писаренко НАН України Проблемы прочности Научно-технический раздел Dynamic Stress Intensity Factor for Interfacial Cracks of Mode III Emanating from Circular Cavities in Piezoelectric Bimaterials Динамический коэффициент интенсивности напряжений для трещины продольного сдвига, находящейся на границе раздела и исходящей из круглых полостей в двух пьезоэлектрических материалах Article published earlier |
| institution |
Digital Library of Periodicals of National Academy of Sciences of Ukraine |
| collection |
DSpace DC |
| title |
Dynamic Stress Intensity Factor for Interfacial Cracks of Mode III Emanating from Circular Cavities in Piezoelectric Bimaterials |
| spellingShingle |
Dynamic Stress Intensity Factor for Interfacial Cracks of Mode III Emanating from Circular Cavities in Piezoelectric Bimaterials Li, D. Wang, H.C. Wu, L.X. Научно-технический раздел |
| title_short |
Dynamic Stress Intensity Factor for Interfacial Cracks of Mode III Emanating from Circular Cavities in Piezoelectric Bimaterials |
| title_full |
Dynamic Stress Intensity Factor for Interfacial Cracks of Mode III Emanating from Circular Cavities in Piezoelectric Bimaterials |
| title_fullStr |
Dynamic Stress Intensity Factor for Interfacial Cracks of Mode III Emanating from Circular Cavities in Piezoelectric Bimaterials |
| title_full_unstemmed |
Dynamic Stress Intensity Factor for Interfacial Cracks of Mode III Emanating from Circular Cavities in Piezoelectric Bimaterials |
| title_sort |
dynamic stress intensity factor for interfacial cracks of mode iii emanating from circular cavities in piezoelectric bimaterials |
| author |
Li, D. Wang, H.C. Wu, L.X. |
| author_facet |
Li, D. Wang, H.C. Wu, L.X. |
| topic |
Научно-технический раздел |
| topic_facet |
Научно-технический раздел |
| publishDate |
2016 |
| language |
English |
| container_title |
Проблемы прочности |
| publisher |
Інститут проблем міцності ім. Г.С. Писаренко НАН України |
| format |
Article |
| title_alt |
Динамический коэффициент интенсивности напряжений для трещины продольного сдвига, находящейся на границе раздела и исходящей из круглых полостей в двух пьезоэлектрических материалах |
| description |
This paper investigates dynamic stress intensity factors in piezoelectric bimaterials with interfacial cracks emanating from the circular cavities under steady SH-waves. The interfacial cracks are assumed to be permeable. Green functions for the experiment were constructed through complex variable and wave function expansion methods. Based on the crack-division and conjunction techniques, a series of Fredholm integral equations of the first kind were established to calculate the stress intensity of the crack tips. Direct numerical integration was used to solve the equations. Some numerical results were plotted to indicate the influence of the defect geometry, material constants, and SH-wave frequencies on dynamic stress intensity factors.
|
| issn |
0556-171X |
| url |
https://nasplib.isofts.kiev.ua/handle/123456789/173417 |
| citation_txt |
Dynamic Stress Intensity Factor for Interfacial Cracks of Mode III Emanating from Circular Cavities in Piezoelectric Bimaterials / D. Li, H.C. Wang, L.X. Wu // Проблемы прочности. — 2016. — № 1. — С. 58-68. — Бібліогр.: 13 назв. — англ. |
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2025-12-07T19:23:29Z |
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