Dynamic Stress Intensity Factor for Interfacial Cracks of Mode III Emanating from Circular Cavities in Piezoelectric Bimaterials

This paper investigates dynamic stress intensity factors in piezoelectric bimaterials with interfacial cracks emanating from the circular cavities under steady SH-waves. The interfacial cracks are assumed to be permeable. Green functions for the experiment were constructed through complex variable a...

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Бібліографічні деталі
Опубліковано в: :Проблемы прочности
Дата:2016
Автори: Li, D., Wang, H.C., Wu, L.X.
Формат: Стаття
Мова:Англійська
Опубліковано: Інститут проблем міцності ім. Г.С. Писаренко НАН України 2016
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Онлайн доступ:https://nasplib.isofts.kiev.ua/handle/123456789/173417
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Назва журналу:Digital Library of Periodicals of National Academy of Sciences of Ukraine
Цитувати:Dynamic Stress Intensity Factor for Interfacial Cracks of Mode III Emanating from Circular Cavities in Piezoelectric Bimaterials / D. Li, H.C. Wang, L.X. Wu // Проблемы прочности. — 2016. — № 1. — С. 58-68. — Бібліогр.: 13 назв. — англ.

Репозитарії

Digital Library of Periodicals of National Academy of Sciences of Ukraine
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author Li, D.
Wang, H.C.
Wu, L.X.
author_facet Li, D.
Wang, H.C.
Wu, L.X.
citation_txt Dynamic Stress Intensity Factor for Interfacial Cracks of Mode III Emanating from Circular Cavities in Piezoelectric Bimaterials / D. Li, H.C. Wang, L.X. Wu // Проблемы прочности. — 2016. — № 1. — С. 58-68. — Бібліогр.: 13 назв. — англ.
collection DSpace DC
container_title Проблемы прочности
description This paper investigates dynamic stress intensity factors in piezoelectric bimaterials with interfacial cracks emanating from the circular cavities under steady SH-waves. The interfacial cracks are assumed to be permeable. Green functions for the experiment were constructed through complex variable and wave function expansion methods. Based on the crack-division and conjunction techniques, a series of Fredholm integral equations of the first kind were established to calculate the stress intensity of the crack tips. Direct numerical integration was used to solve the equations. Some numerical results were plotted to indicate the influence of the defect geometry, material constants, and SH-wave frequencies on dynamic stress intensity factors.
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language English
last_indexed 2025-12-07T19:23:29Z
publishDate 2016
publisher Інститут проблем міцності ім. Г.С. Писаренко НАН України
record_format dspace
spelling Li, D.
Wang, H.C.
Wu, L.X.
2020-12-03T20:19:04Z
2020-12-03T20:19:04Z
2016
Dynamic Stress Intensity Factor for Interfacial Cracks of Mode III Emanating from Circular Cavities in Piezoelectric Bimaterials / D. Li, H.C. Wang, L.X. Wu // Проблемы прочности. — 2016. — № 1. — С. 58-68. — Бібліогр.: 13 назв. — англ.
0556-171X
https://nasplib.isofts.kiev.ua/handle/123456789/173417
539.4
This paper investigates dynamic stress intensity factors in piezoelectric bimaterials with interfacial cracks emanating from the circular cavities under steady SH-waves. The interfacial cracks are assumed to be permeable. Green functions for the experiment were constructed through complex variable and wave function expansion methods. Based on the crack-division and conjunction techniques, a series of Fredholm integral equations of the first kind were established to calculate the stress intensity of the crack tips. Direct numerical integration was used to solve the equations. Some numerical results were plotted to indicate the influence of the defect geometry, material constants, and SH-wave frequencies on dynamic stress intensity factors.
The authors are grateful for the support of the National Science Fund for Young Scholars of Hebei Education Department (Q2012031).
en
Інститут проблем міцності ім. Г.С. Писаренко НАН України
Проблемы прочности
Научно-технический раздел
Dynamic Stress Intensity Factor for Interfacial Cracks of Mode III Emanating from Circular Cavities in Piezoelectric Bimaterials
Динамический коэффициент интенсивности напряжений для трещины продольного сдвига, находящейся на границе раздела и исходящей из круглых полостей в двух пьезоэлектрических материалах
Article
published earlier
spellingShingle Dynamic Stress Intensity Factor for Interfacial Cracks of Mode III Emanating from Circular Cavities in Piezoelectric Bimaterials
Li, D.
Wang, H.C.
Wu, L.X.
Научно-технический раздел
title Dynamic Stress Intensity Factor for Interfacial Cracks of Mode III Emanating from Circular Cavities in Piezoelectric Bimaterials
title_alt Динамический коэффициент интенсивности напряжений для трещины продольного сдвига, находящейся на границе раздела и исходящей из круглых полостей в двух пьезоэлектрических материалах
title_full Dynamic Stress Intensity Factor for Interfacial Cracks of Mode III Emanating from Circular Cavities in Piezoelectric Bimaterials
title_fullStr Dynamic Stress Intensity Factor for Interfacial Cracks of Mode III Emanating from Circular Cavities in Piezoelectric Bimaterials
title_full_unstemmed Dynamic Stress Intensity Factor for Interfacial Cracks of Mode III Emanating from Circular Cavities in Piezoelectric Bimaterials
title_short Dynamic Stress Intensity Factor for Interfacial Cracks of Mode III Emanating from Circular Cavities in Piezoelectric Bimaterials
title_sort dynamic stress intensity factor for interfacial cracks of mode iii emanating from circular cavities in piezoelectric bimaterials
topic Научно-технический раздел
topic_facet Научно-технический раздел
url https://nasplib.isofts.kiev.ua/handle/123456789/173417
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