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Dynamic Stress Intensity Factor for Interfacial Cracks of Mode III Emanating from Circular Cavities in Piezoelectric Bimaterials

This paper investigates dynamic stress intensity factors in piezoelectric bimaterials with interfacial cracks emanating from the circular cavities under steady SH-waves. The interfacial cracks are assumed to be permeable. Green functions for the experiment were constructed through complex variable a...

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Bibliographic Details
Published in:Проблемы прочности
Date:2016
ISSN:0556-171X
Main Authors: Li, D., Wang, H.C., Wu, L.X.
Format: Article
Language:English
Published: Інститут проблем міцності ім. Г.С. Писаренко НАН України 2016
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Научно-технический раздел
Online Access:https://nasplib.isofts.kiev.ua/handle/123456789/173417
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Journal Title:Digital Library of Periodicals of National Academy of Sciences of Ukraine
Cite this:Dynamic Stress Intensity Factor for Interfacial Cracks of Mode III Emanating from Circular Cavities in Piezoelectric Bimaterials / D. Li, H.C. Wang, L.X. Wu // Проблемы прочности. — 2016. — № 1. — С. 58-68. — Бібліогр.: 13 назв. — англ.

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Digital Library of Periodicals of National Academy of Sciences of Ukraine

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