APA (7th ed.) Citation

Wang, C., Fan, J., Li, F., & Liu, J. (2018). Electron Backscatter Diffraction Analysis of the Microstructure Fineness in Pure Copper under Torsional Deformation. Проблемы прочности.

Chicago Style (17th ed.) Citation

Wang, C.P, J.K Fan, F.G Li, and J.C Liu. "Electron Backscatter Diffraction Analysis of the Microstructure Fineness in Pure Copper Under Torsional Deformation." Проблемы прочности 2018.

MLA (8th ed.) Citation

Wang, C.P, et al. "Electron Backscatter Diffraction Analysis of the Microstructure Fineness in Pure Copper Under Torsional Deformation." Проблемы прочности, 2018.

Warning: These citations may not always be 100% accurate.