Electron Backscatter Diffraction Analysis of the Microstructure Fineness in Pure Copper under Torsional Deformation

• Veröffentlicht in: Проблемы прочности
• Datum: 2018
• ISSN: 0556-171X
• Hauptverfasser: Wang, C.P., Fan, J.K., Li, F.G., Liu, J.C.
• Format: Artikel
• Sprache: Englisch
• Veröffentlicht: Інститут проблем міцності ім. Г.С. Писаренко НАН України 2018
• Schlagworte: Научно-технический раздел
• Online Zugang: https://nasplib.isofts.kiev.ua/handle/123456789/173818
• Назва журналу: Digital Library of Periodicals of National Academy of Sciences of Ukraine
• Zitieren: Electron Backscatter Diffraction Analysis of the Microstructure Fineness in Pure Copper under Torsional Deformation / C.P. Wang, J.K. Fan, F.G. Li, J.C. Liu // Проблемы прочности. — 2018. — № 1. — С. 106-111. — Бібліогр.: 13 назв. — англ.

Torsional deformation is regarded a promising deformation procedure to prepare the gradient structural materials. Pure copper was subjected to large plastic strains in torsion. Electron backscatter diffraction analysis was used to explore the microstructure evolution. The observations demonstrate th...