Jiang, Q., Zhao, H., & Yan, H. (2018). Numerical Simulation of the Thermomechanical Behavior of a Hot Stamping Die. Проблемы прочности.
Chicago Style (17th ed.) CitationJiang, Q.Y, H.Y Zhao, and H.F Yan. "Numerical Simulation of the Thermomechanical Behavior of a Hot Stamping Die." Проблемы прочности 2018.
MLA (8th ed.) CitationJiang, Q.Y, et al. "Numerical Simulation of the Thermomechanical Behavior of a Hot Stamping Die." Проблемы прочности, 2018.
Warning: These citations may not always be 100% accurate.