Contact Deformation Behavior of an Elastic Silicone/SiC Abrasive in Grinding and Polishing

• Veröffentlicht in: Проблемы прочности
• Datum: 2018
• Hauptverfasser: Li, N., Ding, J.F., Xuan, Z.Y., Huang, J.M., Lin, Z.P.
• Format: Artikel
• Sprache: Englisch
• Veröffentlicht: Інститут проблем міцності ім. Г.С. Писаренко НАН України 2018
• Schlagworte: Научно-технический раздел
• Online Zugang: https://nasplib.isofts.kiev.ua/handle/123456789/173908
• Назва журналу: Digital Library of Periodicals of National Academy of Sciences of Ukraine
• Zitieren: Contact Deformation Behavior of an Elastic Silicone/SiC Abrasive in Grinding and Polishing / N. Li, J.F. Ding, Z.Y. Xuan, J.M. Huang, Z.P. Lin // Проблемы прочности. — 2018. — № 3. — С. 64-70. — Бібліогр.: 18 назв. — англ.

An elastic abrasive of the new type having the advantage of effectively controlled contact pressure and uniform deformation was developed. It provides complete lamination of the surface, effective treatment of the curved mold cavity, as well as improves the processing efficiency. It permits of fine...