Surface impedance of copper MOB depending on the annealing temperature and deformation degree
Results of researches of influence of annealing temperature and deformation degree on mechanical features of
 copper MOB are presented. It is shown that minimal surface resistance is observed in copper samples that were subject
 to pre-deformation and were annealed in the range of te...
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| Опубліковано в: : | Вопросы атомной науки и техники |
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| Дата: | 2006 |
| Автори: | , , , |
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Національний науковий центр «Харківський фізико-технічний інститут» НАН України
2006
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| Цитувати: | Surface impedance of copper MOB depending on the annealing temperature and deformation degree / V.A. Kutovoj, A.A. Nikolaenko, P.I. Stoev, D.V. Vinogradov // Вопросы атомной науки и техники. — 2006. — № 3. — С. 95-97. — Бібліогр.: 7 назв. — англ. |
Репозитарії
Digital Library of Periodicals of National Academy of Sciences of Ukraine| _version_ | 1860190034542460928 |
|---|---|
| author | Kutovoj, V.A. Nikolaenko, A.A. Stoev, P.I. Vinogradov, D.V. |
| author_facet | Kutovoj, V.A. Nikolaenko, A.A. Stoev, P.I. Vinogradov, D.V. |
| citation_txt | Surface impedance of copper MOB depending on the annealing temperature and deformation degree / V.A. Kutovoj, A.A. Nikolaenko, P.I. Stoev, D.V. Vinogradov // Вопросы атомной науки и техники. — 2006. — № 3. — С. 95-97. — Бібліогр.: 7 назв. — англ. |
| collection | DSpace DC |
| container_title | Вопросы атомной науки и техники |
| description | Results of researches of influence of annealing temperature and deformation degree on mechanical features of
copper MOB are presented. It is shown that minimal surface resistance is observed in copper samples that were subject
to pre-deformation and were annealed in the range of temperatures 873…923K.
Представлены результаты исследований влияния температуры отжига и степени деформации на электромеханические характеристики меди марки МОБ. Показано, что минимальное поверхностное сопротивление наблюдается у меди, деформированной и отожженной в интервале температур 873…923К.
Представлені результати досліджень впливу температури відпалу та степені деформації на
електромеханічні характеристики міді марки МОБ. Показано, що мінімальний поверхневий опір
спостерігається у зразків міді, підверненої деформації і відпаленої в інтервалі температур 873…923К.
|
| first_indexed | 2025-12-07T18:06:03Z |
| format | Article |
| fulltext |
SURFACE IMPEDANCE OF COPPER MOB DEPENDING
ON THE ANNEALING TEMPERATURE AND DEFORMATION DEGREE
V.A. Kutovoj, A.A. Nikolaenko, P.I. Stoev, D.V. Vinogradov
NSC KIPT, Kharkov, Ukraine
Results of researches of influence of annealing temperature and deformation degree on mechanical features of
copper MOB are presented. It is shown that minimal surface resistance is observed in copper samples that were sub-
ject to pre-deformation and were annealed in the range of temperatures 873…923K.
PACS: 61.72.-y
The main factor influencing upon high-frequency
features of HF-systems is a condition of the current-con-
ducting metal layer they are made of. One of the meth-
ods of checking of the surface layer condition of metal
is measurement of the surface resistance. Copper is one
of the main constructional materials in accelerator tech-
nology. Wide use of copper is caused by its favorable
combination of its properties: high electro- and heat
conductivity with satisfactory toughness. The results of
research on influence of mechanical and thermal pro-
cessing on mechanical characteristics of copper and its
electro-conductivity at direct current are presented in
works [1-4]. However, data on influence of the mechan-
ical and thermal processing on surface resistance of cop-
per are practically absent.
SAMPLES AND METHODS
In the given work for studies copper of the mark
MOB, GOST (all-Union State Standard) 857-78, is
used. Given GOST corresponds to the composition,
copper 99,97%, silicon, oxygen on 0,001; stibium, tin,
arsenic, nickel, phosphorous on 0,002; lead, sulfur, zinc
on 0,003; iron 0,004. Complex study of influence of me-
chanical-thermal processing consisted of determination
of mechanical characteristics (yield stress, ultimate
stress, lengthening); measurement microhardness, study
of structure, determination of parameters of acoustic
emission, measurement of electric resistance on direct
current, electric impedance.
Billets for samples in plate form (thickness is 2 mm)
were carved by spark cutting. Then, billets-plates were
deformed by rolling up to attainment of deformation 10,
20 and 30%. From these billets samples for tests on
strain (work part 25×4×2 mm), determination of micro-
hardness and structure (20×20×2 mm), determination of
resistance on direct current (80×1×2 mm) were obtained
by spark cutting. Mechanical tests on strain were con-
ducted on multipurpose test machine 1958-U10-1. Mea-
surement of microhardness on direct current (at room
and nitric temperature) was conducted by means of
four-contact method (distance between potentiometric
contacts was ≈70 mm), measured current was ≈ 1A, volt-
age on the sample was recorded by digital voltmeter SCH
68003. Samples were studied in initial state and after the
thermal processing that was conducted by means of
isochronous vacuum annealing for one hour in tempera-
ture range 473…1173K. Investigation of the surface re-
sistance of the studied copper was conducted on cylindri-
cal cavity resonator, wave type H111, resonance frequency
3 hertz and was determined from expression:
R=G/Q , (1)
where R is surface resistance; G is a resonator geometri-
cal factor; Q is a resonator own quality factor (Q-
factor). A resonance method is usually used for measur-
ing the own Q-factor of resonance systems, and method
of damping factor [6] is used for measuring Q-factor of
order 104 and higher.
INVESTIGATION RESULTS
Fig.1 shows the change dependence of mechanical
features of strainless samples of copper from annealing
temperature. From the figure it is clear that with increas-
ing of temperature the ultimate stress and yield decrease
steadily, and the relative lengthening of material in-
creases. Similar dependencies show the deformed sam-
ples of copper as well.
Fig.1. Dependence of mechanical features of copper
samples of the mark MOB form the annealing tempera-
ture; curve 1 – yield stress, curve 2 – ultimate stress,
curve 3 – relative lengthening
Fig.2 shows the change dependence of microhard-
ness change of copper samples in initial state and after
different deformation degree from the annealing temper-
ature.
Fig.2. Microhardness dependence of copper samples of
the mark MOB with different deformation from the an-
nealing temperature
It is clear that by annealing temperature increasing
the microhardness value starts to decrease reaching the
minimum and then its small growth is observed. A ten-
____________________________________________________________
PROBLEMS OF ATOMIC SCIENCE AND TECHNOLOGY. 2006. № 3.
Series: Nuclear Physics Investigations (47), p.95-97. 95
dency is well tracked: the higher deformation degree of
the sample is the higher temperature is at which the
minimum value of microhardness is observed. The min-
imum microhardness is reached in annealing tempera-
ture range 723…923K (in dependence from deformation
degree) for the investigated samples.
Figs.3, 4 show the microstructures of copper sam-
ples after different modes of thermal processing and
change dependency of the grain dimension from the an-
nealing temperature.
Fig.3. Microstructure of copper samples: a – initial
state; b – annealing 873 K; c – annealing 1173 K
Fig.4. Dependency of the grain dimension of copper
samples of the mark MOB with different deformation
from the annealing temperature
Metallographic studies show that in initial state and
after deformation 10...30% material has a structure with
grain dimension 125...165 mkm.
From Fig.4 it is clear that with increasing of the an-
nealing temperature the grain value of the studied sam-
ples starts to decrease reaching the minimum and a
strong enough growth (in 5...7 times) is observed at
temperature higher than 873K. It is determined that the
higher deformation degree of the copper of the mark
MOB is, the higher annealing temperature is needed to
obtain the minimal grain dimension.
A certain velocity deceleration of decreasing the
grain dimension in the annealing temperature range
473…573K is caused, as we see it, by removing the in-
ternal voltages of I and II type that appear in material
during deformation, and different value of the annealing
temperature under which the minimal grain dimension
is obtained (17...19 mkm) – by peculiarity of recrystal-
lization passing. These peculiarities are well explained
by diagrams of recrystallization, available in literature,
that link the dependency of grain size from the deforma-
tion degree and annealing temperature [7].
Fig.5. Dependency regarding relative conductivity
change on direct current (under nitric temperature) of
copper of the mark MOB with different deformation
from the annealing temperature
Fig.5 shows the change dependency of the removed
resistance of copper samples (with different deformation
value) on direct current from the annealing temperature,
ρ0 is conductivity on direct current of the initial sample
of copper of the mark MOB under the nitric tempera-
ture; ρ is conductivi; ρ is conductivity of samples of
copper of the mark MOB under different deformation
degree and the annealing temperature cooled up to the
nitric temperature. From the Fig.5 it is clear that the in
temperature range 873K for all the studied samples the
specific resistance under the nitric temperature has a
minimal value. Thus, the data analysis of the study of
microhardness, structure and electrical resistance
showed that during annealing there is a temperature
range where a minimal value of the studied features is
reached. Under more low annealing temperatures pro-
cesses of removing internal voltages and recrystalliza-
tion do not yet have time to pass completely, so, though
the studied features decrease they do not reach minimal
values.
This assumption is confirmed by data analysis of the
copper acoustic emission study. As we have showed it
earlier for titanium and beryllium, and it is present in
the given work, the acoustic emission of the deformed
copper samples in initial state is very low [8]. With the
annealing temperature increase the activity of copper
samples acoustic emission increased. Amplitude analy-
sis of AE sample signals that were annealed under tem-
peratures higher than 873…1173K showed essential in-
crease in signal spectrum of low and high amplitudes.
This unambiguously indicates the essential grain growth
at annealed samples and process activations of impuri-
ties dissolution.
To improve Q-factor of HF-systems it is necessary
to know how the surface resistance of copper changes in
96
the field of classical skin-effect in dependence from
thermal and mechanical processing of the conductive
surface. A cycle of investigations on cylindrical copper
resonators (wave type H111, resonance frequency 3 Hz)
was conducted for this purpose.
From the investigation results it was established that
minimal value of the surface resistance of copper of the
mark MOB is reached under the annealing temperature
873K and deformation degree 30%, Fig.6.
Fig.6 shows the results regarding the change of the
surface resistance of copper of the mark MOB under the
nitric temperature depending upon the thermal and me-
chanical processing of the conductive surface.
Fig.6. Dependency regarding the change of the surface
resistance of copper of the mark MOB with different de-
formation from the annealing temperature under the ni-
tric temperature
R0 is a surface resistance of the initial sample; R is a
surface resistance of the samples copper of the mark
MOB depending upon the deformation degree and the
annealing temperature.
From the investigation results it is clear that the sur-
face resistance increases during the deformation of sam-
ples of copper of the mark MOB. The higher deforma-
tion degree is the more investigated samples are, surface
resistance decreases and becomes minimal under the an-
nealing temperature in range 800…900K not depending
upon the deformation degree. With the temperature an-
nealing increase the surface resistance increases also
and under the annealing temperature higher than tem-
perature 1000K and deformation degree starts to influ-
ence the surface resistance. The higher deformation is
the bigger surface resistance is.
CONCLUSION
The study of vacuum annealing temperature influ-
ence in range 473…1173K and deformation degree (10,
20, 30%) on mechanical features of copper of the mark
MOB, microhardnes, material structure, conductivity on
direct current and surface impedance of copper of the
mark MOB under the room temperature and the temper-
ature of liquid nitrogen was studied. It is shown that the
minimal grain dimension, hardness and specific resis-
tance are observed in copper samples that were de-
formed 30% and were annealed in vacuum under tem-
perature 873K. This thermal and mechanical processing
leads to increasing of Q-factor of resonator HF-systems
under the nitric temperature in 2,6 times in comparison
with resonator system that operates under the room tem-
perature. Therefore, to provide a minimal Q-factor of
resonator HF-systems in process of their production it is
necessary to subject material to deformation and con-
duct further thermal processing of the produced res-
onator under the recommended vacuum annealing tem-
perature.
REFERENCES
1. V.A. Kolachev, V.A. Lebanon, V.I. Elagin. Metal
science and thermal treatment of metals and alloys:
“Metallurgy”, 1981, p.210-224.
2. A.V. Kobyloiv. Mechanical and thermal character-
istics of metals. “Reference”, 1987, p.29-42.
3. I.I. Novikov The Theory of the thermal treatment of
metal: “Metallurgy”, 1986, p.118-120.
4. B.S. Tikhonov. Copper and copper deformed half
stuff: Information about nonferrous metal, $, 74p.
5. V.M. Azhazha, K.V. Kovtun, V.A. Kutovoy,
N.A. Khizhnyak. Study of surface resistance Al, Ve
and Al- Ve alloy under low temperature // QAScT,
Series: Nucleus Physics. 2000, №2, p.94-96.
6. A.P. Smiryagin, N.A. Smiryagina. Industrial non-
ferrous metals and alloys. “Metallurgy”, 1974,
p.488.
7. P.I. Stoev, I.I. Papirov. Influence of the surface
conditions on acoustic emission // Physics of met-
als. 1991, v.13, №10, p.28-35.
ПОВЕРХНОСТНЫЙ ИМПЕДАНС МЕДИ МАРКИ МОБ В ЗАВИСИМОСТИ ОТ ТЕМПЕРАТУРЫ
ОТЖИГА И СТЕПЕНИ ДЕФОРМАЦИИ
В.А. Кутовой, A.A. Николаенко, П.И. Стоев, Д.В. Виноградов
Представлены результаты исследований влияния температуры отжига и степени деформации на электро-
механические характеристики меди марки МОБ. Показано, что минимальное поверхностное сопротивление
наблюдается у меди, деформированной и отожженной в интервале температур 873…923К.
ПОВЕРХНЕВИЙ ІМПЕДАНС МІДІ МАРКИ МОБ В ЗАЛЕЖНОСТІ ВІД ТЕМПЕРАТУРИ ВІДПАЛУ
ТА СТЕПЕНІ ДЕФОРМАЦІЇ
В.О. Кутовий, A.О. Ніколаєнко, П.І. Стоєв, Д.В. Виноградов
Представлені результати досліджень впливу температури відпалу та степені деформації на
електромеханічні характеристики міді марки МОБ. Показано, що мінімальний поверхневий опір
спостерігається у зразків міді, підверненої деформації і відпаленої в інтервалі температур 873…923К.
____________________________________________________________
PROBLEMS OF ATOMIC SCIENCE AND TECHNOLOGY. 2006. № 3.
Series: Nuclear Physics Investigations (47), p.95-97. 97
SAMPLES AND METHODS
INVESTIGATION RESULTS
CONCLUSION
REFERENCES
В.О. Кутовий, A.О. Ніколаєнко, П.І. Стоєв, Д.В. Виноградов
|
| id | nasplib_isofts_kiev_ua-123456789-79738 |
| institution | Digital Library of Periodicals of National Academy of Sciences of Ukraine |
| issn | 1562-6016 |
| language | English |
| last_indexed | 2025-12-07T18:06:03Z |
| publishDate | 2006 |
| publisher | Національний науковий центр «Харківський фізико-технічний інститут» НАН України |
| record_format | dspace |
| spelling | Kutovoj, V.A. Nikolaenko, A.A. Stoev, P.I. Vinogradov, D.V. 2015-04-04T12:38:27Z 2015-04-04T12:38:27Z 2006 Surface impedance of copper MOB depending on the annealing temperature and deformation degree / V.A. Kutovoj, A.A. Nikolaenko, P.I. Stoev, D.V. Vinogradov // Вопросы атомной науки и техники. — 2006. — № 3. — С. 95-97. — Бібліогр.: 7 назв. — англ. 1562-6016 PACS: 61.72.-y https://nasplib.isofts.kiev.ua/handle/123456789/79738 Results of researches of influence of annealing temperature and deformation degree on mechanical features of
 copper MOB are presented. It is shown that minimal surface resistance is observed in copper samples that were subject
 to pre-deformation and were annealed in the range of temperatures 873…923K. Представлены результаты исследований влияния температуры отжига и степени деформации на электромеханические характеристики меди марки МОБ. Показано, что минимальное поверхностное сопротивление наблюдается у меди, деформированной и отожженной в интервале температур 873…923К. Представлені результати досліджень впливу температури відпалу та степені деформації на
 електромеханічні характеристики міді марки МОБ. Показано, що мінімальний поверхневий опір
 спостерігається у зразків міді, підверненої деформації і відпаленої в інтервалі температур 873…923К. en Національний науковий центр «Харківський фізико-технічний інститут» НАН України Вопросы атомной науки и техники Ускорители заряженных частиц Surface impedance of copper MOB depending on the annealing temperature and deformation degree Поверхностный импеданс меди марки МОБ в зависимости от температуры отжига и степени деформации Поверхневий імпеданс міді марки МОБ в залежності від температури відпалу та степені деформації Article published earlier |
| spellingShingle | Surface impedance of copper MOB depending on the annealing temperature and deformation degree Kutovoj, V.A. Nikolaenko, A.A. Stoev, P.I. Vinogradov, D.V. Ускорители заряженных частиц |
| title | Surface impedance of copper MOB depending on the annealing temperature and deformation degree |
| title_alt | Поверхностный импеданс меди марки МОБ в зависимости от температуры отжига и степени деформации Поверхневий імпеданс міді марки МОБ в залежності від температури відпалу та степені деформації |
| title_full | Surface impedance of copper MOB depending on the annealing temperature and deformation degree |
| title_fullStr | Surface impedance of copper MOB depending on the annealing temperature and deformation degree |
| title_full_unstemmed | Surface impedance of copper MOB depending on the annealing temperature and deformation degree |
| title_short | Surface impedance of copper MOB depending on the annealing temperature and deformation degree |
| title_sort | surface impedance of copper mob depending on the annealing temperature and deformation degree |
| topic | Ускорители заряженных частиц |
| topic_facet | Ускорители заряженных частиц |
| url | https://nasplib.isofts.kiev.ua/handle/123456789/79738 |
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