Монтаж микросборок с подложкой из кремния
A technology is presented for mounting bare dies with volumetric leads and components in mini-packages onto a silicon board. Several design and technological options for mounting a silicon microassembly onto a metal base are considered.
Збережено в:
| Дата: | 2005 |
|---|---|
| Автор: | |
| Формат: | Стаття |
| Мова: | Українська |
| Опубліковано: |
PE "Politekhperiodika", Book and Journal Publishers
2005
|
| Теми: | |
| Онлайн доступ: | https://www.tkea.com.ua/index.php/journal/article/view/TKEA2005.2.46 |
| Теги: |
Додати тег
Немає тегів, Будьте першим, хто поставить тег для цього запису!
|
| Назва журналу: | Technology and design in electronic equipment |
Репозитарії
Technology and design in electronic equipment| Резюме: | A technology is presented for mounting bare dies with volumetric leads and components in mini-packages onto a silicon board. Several design and technological options for mounting a silicon microassembly onto a metal base are considered. |
|---|