Перспективы развития тонкопленочных микросборок
Based on the analysis of certain structural and technological options, the prospects for increasing the integration of thin-film microassemblies with substrates made of sitall, polycor, sapphire, and silicon are considered. The technology for manufacturing chromium resistors on silicon is described....
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| Datum: | 2005 |
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| 1. Verfasser: | |
| Format: | Artikel |
| Sprache: | Ukrainisch |
| Veröffentlicht: |
PE "Politekhperiodika", Book and Journal Publishers
2005
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| Schlagworte: | |
| Online Zugang: | https://www.tkea.com.ua/index.php/journal/article/view/TKEA2005.1.03 |
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| Назва журналу: | Technology and design in electronic equipment |
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Technology and design in electronic equipment| Zusammenfassung: | Based on the analysis of certain structural and technological options, the prospects for increasing the integration of thin-film microassemblies with substrates made of sitall, polycor, sapphire, and silicon are considered. The technology for manufacturing chromium resistors on silicon is described. An assessment of the packing density of printed and silicon boards is provided. |
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