Перспективы развития тонкопленочных микросборок

Based on the analysis of certain structural and technological options, the prospects for increasing the integration of thin-film microassemblies with substrates made of sitall, polycor, sapphire, and silicon are considered. The technology for manufacturing chromium resistors on silicon is described....

Full description

Saved in:
Bibliographic Details
Date:2005
Main Author: Spirin, V. G.
Format: Article
Language:Ukrainian
Published: PE "Politekhperiodika", Book and Journal Publishers 2005
Subjects:
Online Access:https://www.tkea.com.ua/index.php/journal/article/view/TKEA2005.1.03
Tags: Add Tag
No Tags, Be the first to tag this record!
Journal Title:Technology and design in electronic equipment

Institution

Technology and design in electronic equipment
Description
Summary:Based on the analysis of certain structural and technological options, the prospects for increasing the integration of thin-film microassemblies with substrates made of sitall, polycor, sapphire, and silicon are considered. The technology for manufacturing chromium resistors on silicon is described. An assessment of the packing density of printed and silicon boards is provided.