Перспективы развития тонкопленочных микросборок

• Date: 2005
• Main Author: Spirin, V. G.
• Format: Article
• Language: Ukrainian
• Published: PE "Politekhperiodika", Book and Journal Publishers 2005
• Subjects: тонкопленочная микросборка; подложка; резисторы на кремнии; плотность упаковки; нормы проектирования
• Online Access: https://www.tkea.com.ua/index.php/journal/article/view/TKEA2005.1.03
• Journal Title: Technology and design in electronic equipment

Based on the analysis of certain structural and technological options, the prospects for increasing the integration of thin-film microassemblies with substrates made of sitall, polycor, sapphire, and silicon are considered. The technology for manufacturing chromium resistors on silicon is described....