Конструкторско-технологические варианты коммутационных плат с подложкой из кремния
The design and technological options of switching boards with a silicon substrate featuring two and three switching levels are considered, based on well-established industrial technologies. The use of these boards ensures the maximum possible packing density of microassemblies at a relatively low pr...
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| Date: | 2005 |
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| Main Author: | |
| Format: | Article |
| Language: | Ukrainian |
| Published: |
PE "Politekhperiodika", Book and Journal Publishers
2005
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| Subjects: | |
| Online Access: | https://www.tkea.com.ua/index.php/journal/article/view/TKEA2005.1.48 |
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| Journal Title: | Technology and design in electronic equipment |
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Technology and design in electronic equipment| Summary: | The design and technological options of switching boards with a silicon substrate featuring two and three switching levels are considered, based on well-established industrial technologies. The use of these boards ensures the maximum possible packing density of microassemblies at a relatively low production cost. |
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