Конструкторско-технологические варианты коммутационных плат с подложкой из кремния

• Date: 2005
• Main Author: Spirin, V. G.
• Format: Article
• Language: Ukrainian
• Published: PE "Politekhperiodika", Book and Journal Publishers 2005
• Subjects: кремниевая подложка; кремниевая коммутационная плата
• Online Access: https://www.tkea.com.ua/index.php/journal/article/view/TKEA2005.1.48
• Journal Title: Technology and design in electronic equipment

The design and technological options of switching boards with a silicon substrate featuring two and three switching levels are considered, based on well-established industrial technologies. The use of these boards ensures the maximum possible packing density of microassemblies at a relatively low pr...