Перспективные материалы для низкоомных толстопленочных резистивных элементов

• Date: 2005
• Main Authors: Smirnov, A. N., Puchkova, N. S., Sidorets, R. G., Lemza, V. D.
• Format: Article
• Language: Ukrainian
• Published: PE "Politekhperiodika", Book and Journal Publishers 2005
• Subjects: резистивные элементы; композиционные пасты; толстопленочная технология
• Online Access: https://www.tkea.com.ua/index.php/journal/article/view/TKEA2005.1.58
• Journal Title: Technology and design in electronic equipment

The development of highly stable low-resistance variable resistors using thick-film technology is discussed. A paste system based on Ag/Ru/Pd with 35–45% glass binder content provides excellent surface properties and technological characteristics of the resistors. The ability to obtain intermediate...