Исследование проволочного радиатора с тепловыми трубами для средств вычислительной техники
One approach to improving heat dissipation efficiency from computing components such as high-performance microprocessors is proposed. A prototype wire radiator was studied, consisting of copper wire with a diameter of 0.12 mm wound around a frame of two heat pipes, each 6 mm in diameter and 500 mm l...
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| Datum: | 2004 |
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| Hauptverfasser: | , , |
| Format: | Artikel |
| Sprache: | Ukrainisch |
| Veröffentlicht: |
PE "Politekhperiodika", Book and Journal Publishers
2004
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| Schlagworte: | |
| Online Zugang: | https://www.tkea.com.ua/index.php/journal/article/view/TKEA2004.6.29 |
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| Назва журналу: | Technology and design in electronic equipment |