Метод проектирования топологии тонкопленочной микросборки с размерами пленочных элементов 10–50 мкм
The proposed method makes it possible to design thin-film elements with minimum sizes of 10–50 μm. The increase in microassembly integration is achieved by compensating for systematic errors in the structural parameters of thin-film elements, by modifying the algorithm for calculating resistor dimen...
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| Date: | 2004 |
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| Main Author: | |
| Format: | Article |
| Language: | Ukrainian |
| Published: |
PE "Politekhperiodika", Book and Journal Publishers
2004
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| Subjects: | |
| Online Access: | https://www.tkea.com.ua/index.php/journal/article/view/TKEA2004.5.06 |
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| Journal Title: | Technology and design in electronic equipment |
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Technology and design in electronic equipment| Summary: | The proposed method makes it possible to design thin-film elements with minimum sizes of 10–50 μm. The increase in microassembly integration is achieved by compensating for systematic errors in the structural parameters of thin-film elements, by modifying the algorithm for calculating resistor dimensions, and by applying specific approaches to the placement of components and resistors. |
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