Метод проектирования топологии тонкопленочной микросборки с размерами пленочных элементов 10–50 мкм
The proposed method makes it possible to design thin-film elements with minimum sizes of 10–50 μm. The increase in microassembly integration is achieved by compensating for systematic errors in the structural parameters of thin-film elements, by modifying the algorithm for calculating resistor dimen...
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| Datum: | 2004 |
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| 1. Verfasser: | |
| Format: | Artikel |
| Sprache: | Ukrainisch |
| Veröffentlicht: |
PE "Politekhperiodika", Book and Journal Publishers
2004
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| Schlagworte: | |
| Online Zugang: | https://www.tkea.com.ua/index.php/journal/article/view/TKEA2004.5.06 |
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| Назва журналу: | Technology and design in electronic equipment |